NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.
Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.
An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Dominant Thermal Boundary Resistance in Multi-Walled Carbon Nanotube Bundles Fabricated at Low Temperatures
Published
Author(s)
Ann C. Chiaramonti Debay, Sten Vollebregt, Sarbajit Banerjee, Kees Beenakker, R. Ishihara
Abstract
While carbon nanotubes (CNT) have been suggested as thermal management mate- rial for integrated circuits, the thermal properties and especially the thermal bound- ary resistance (TBR) of as-grown CNT have hardly been investigated. Here the thermal resistance of CNT vias with different bundle lengths and diameters fabri- cated at 500 ◦C are investigated using the 3ω-method. It was found that the thermal resistance hardly changes with length, indicating that the TBR (10 9 −10 10 K/W per tube) dominates the thermal conduction. This in contract to the electrical resistance and temperature coefficient of resistance which both clearly increase with length.
Chiaramonti, A.
, Vollebregt, S.
, Banerjee, S.
, Beenakker, K.
and Ishihara, R.
(2014),
Dominant Thermal Boundary Resistance in Multi-Walled Carbon Nanotube Bundles Fabricated at Low Temperatures, Journal of Applied Physics, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=915307
(Accessed October 10, 2025)