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Dominant Thermal Boundary Resistance in Multi-Walled Carbon Nanotube Bundles Fabricated at Low Temperatures

Published

Author(s)

Ann C. Chiaramonti Debay, Sten Vollebregt, Sarbajit Banerjee, Kees Beenakker, R. Ishihara

Abstract

While carbon nanotubes (CNT) have been suggested as thermal management mate- rial for integrated circuits, the thermal properties and especially the thermal bound- ary resistance (TBR) of as-grown CNT have hardly been investigated. Here the thermal resistance of CNT vias with different bundle lengths and diameters fabri- cated at 500 ◦C are investigated using the 3ω-method. It was found that the thermal resistance hardly changes with length, indicating that the TBR (10 9 −10 10 K/W per tube) dominates the thermal conduction. This in contract to the electrical resistance and temperature coefficient of resistance which both clearly increase with length.
Citation
Journal of Applied Physics

Keywords

carbon nanotubes, thermal boundary layer, thermal transport

Citation

Chiaramonti, A. , Vollebregt, S. , Banerjee, S. , Beenakker, K. and Ishihara, R. (2014), Dominant Thermal Boundary Resistance in Multi-Walled Carbon Nanotube Bundles Fabricated at Low Temperatures, Journal of Applied Physics, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=915307 (Accessed February 26, 2024)
Created July 11, 2014, Updated February 19, 2017