Dominant Thermal Boundary Resistance in Multi-Walled Carbon Nanotube Bundles Fabricated at Low Temperatures

Published: July 11, 2014


Ann C. Chiaramonti Debay, Sten Vollebregt, Sarbajit Banerjee, Kees Beenakker, R. Ishihara


While carbon nanotubes (CNT) have been suggested as thermal management mate- rial for integrated circuits, the thermal properties and especially the thermal bound- ary resistance (TBR) of as-grown CNT have hardly been investigated. Here the thermal resistance of CNT vias with different bundle lengths and diameters fabri- cated at 500 ◦C are investigated using the 3ω-method. It was found that the thermal resistance hardly changes with length, indicating that the TBR (10 9 −10 10 K/W per tube) dominates the thermal conduction. This in contract to the electrical resistance and temperature coefficient of resistance which both clearly increase with length.
Citation: Journal of Applied Physics
Pub Type: Journals

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carbon nanotubes, thermal boundary layer, thermal transport
Created July 11, 2014, Updated February 19, 2017