Schaefer, R.
and Lewis, D.
(2008),
Directional Solidification in a AgCuSn Eutectic Alloy, Journal of Electronic Materials
(Accessed May 19, 2025)
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Directional Solidification in a AgCuSn Eutectic Alloy
Published
Author(s)
,
Abstract
An experimental study of microstructures in a directionally solidified, near-eutectic solder Ag-Cu-Sn alloy has been completed. This material is an important candidate for use as a lead-free solder, and the studies show the origin and velocity dependence of some of the microstructures seen in solder joints. Quantitative sterelogy and microstructural observation were completed for directional solidification experiments where the sample was moved through a gradient furnace at velocities between 0.826 and 500 um/s.Citation
Journal of Electronic Materials
Pub Type
Journals
Keywords
directional solidification, eutectic, lead-free solder
Citation
Issues
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Created October 16, 2008