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Directional Solidification in a AgCuSn Eutectic Alloy

Published

Author(s)

Robert J. Schaefer, D J. Lewis

Abstract

An experimental study of microstructures in a directionally solidified, near-eutectic solder Ag-Cu-Sn alloy has been completed. This material is an important candidate for use as a lead-free solder, and the studies show the origin and velocity dependence of some of the microstructures seen in solder joints. Quantitative sterelogy and microstructural observation were completed for directional solidification experiments where the sample was moved through a gradient furnace at velocities between 0.826 and 500 um/s.
Citation
Journal of Electronic Materials

Keywords

directional solidification, eutectic, lead-free solder

Citation

Schaefer, R. and Lewis, D. (2008), Directional Solidification in a AgCuSn Eutectic Alloy, Journal of Electronic Materials (Accessed May 20, 2024)

Issues

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Created October 16, 2008