Dielectric Spectroscopy During Extrusion Processing of Polyamide-6 Nanocomposites
Rick D. Davis, Anthony J. Bur, Jeffrey W. Gilman, Young Jong Lee, P R. Start
During extrusion processing dielectric spectroscopy was conducted on polyamide-6 (PA6) and organoclay/polyamide-6 nanocomposites. Off-line curve fitting of the on-line dielectric data generated dielectric dispersion parameters that appear sensitive to organoclay concentration and nanomorphology. Specific to these points, the influence of organoclay on the Maxwell-Wagner strength of relaxation and characteristic frequency will be discussed.
ACS PMSE Preprint
dielectric spectroscopy, exfoliation, extrusion, high throughput, nanocomposite, organoclay