Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Control of thermal expansion in a low-density framework modification of silicon

Published

Author(s)

Beekman Mathew, James A. Kaduk, Winnie Wong-Ng, George S. Nolas

Abstract

The low-density clathrate-II modification of silicon, Si136, contains two distinct cage-like voids large enough to accommodate various types of guest atoms which influence both the host structure and its properties. Although the linear coefficient of thermal expansion of Si136 (293 K < T < 423 K) is only about 20% larger than that of the ground state alpha-Si (diamond structure), the coefficient of thermal expansion monotonically increases by more than 150% upon filling the framework cages with Na atoms in NaxSi136 (0 < x < 24), ranging from alpha = 2.6 x 10-6 K- 1 (x = 0) to 6.75 x 10-6 K-1 (x = 24) by only varying the Na content, x. Taken together with the available heat capacity and bulk modulus data, the dramatic increase in thermal expansion can be attributed almost entirely to an increase in the mode-averaged Grüneisen parameter by a factor of more than 2 from x = 0 to x = 24. The results highlight a potential mechanism for tuning thermal expansion, whereby guest atoms are incorporated into the voids of rigid, covalently bonded inorganic frameworks to influence the lattice dynamics.
Citation
Applied Physics Letters
Volume
112

Keywords

Type-II clathrate, thermal expansion, Grüneisen parameter, NaxSi136 (x = 1.1, 5.5, 12.6, 17.3, and 21.9)

Citation

Mathew, B. , Kaduk, J. , Wong-Ng, W. and Nolas, G. (2018), Control of thermal expansion in a low-density framework modification of silicon, Applied Physics Letters, [online], https://doi.org/10.1063/1.5027229, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=925471 (Accessed June 15, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created September 29, 2018, Updated October 12, 2021