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Combinatorial Approaches for Characterizing Thin Film Bond Strength

Published

Author(s)

Martin Chiang, D Kawaguchi, Christopher Stafford

Abstract

A combinatorial approach to the edge delamination test was carried out to obtain the failure map of the epoxy/glass bond joint as a function of both temperature and film thickness. In the combinatorial test, a single specimen of an epoxy film bonded to a glass substrate with thickness gradient was subdivided into separate samples. By applying a temperature gradient orthogonal to the thickness gradient, a failure map was constructed in a single step.The bond failure was a cohesive fracture of glass. Based on the stress-temperature relationship of the epoxy/glass system, the fracture toughness of the glass deduced from the failure map is 0.85 MPa m1/2, in line with the reported value of 0.80 MPa m1/2. The results in this study clearly indicate that the combinatorial edge delamination test can be used to predict the reliability of bond joint as a function of film thickness and temperature and quantify the bond strength in a fast and accurate manner.
Citation
Journal of the American Chemical Society
Volume
16

Keywords

bond strength, combinatorial edge delamination test, epoxy/glass, fracture toughness

Citation

Chiang, M. , Kawaguchi, D. and Stafford, C. (2005), Combinatorial Approaches for Characterizing Thin Film Bond Strength, Journal of the American Chemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852505 (Accessed May 20, 2024)

Issues

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Created December 31, 2004, Updated October 12, 2021