Skip to main content

NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Combinatorial Approaches for Characterizing Thin Film Bond Strength

Published

Author(s)

Martin Chiang, D Kawaguchi, Christopher Stafford

Abstract

A combinatorial approach to the edge delamination test was carried out to obtain the failure map of the epoxy/glass bond joint as a function of both temperature and film thickness. In the combinatorial test, a single specimen of an epoxy film bonded to a glass substrate with thickness gradient was subdivided into separate samples. By applying a temperature gradient orthogonal to the thickness gradient, a failure map was constructed in a single step.The bond failure was a cohesive fracture of glass. Based on the stress-temperature relationship of the epoxy/glass system, the fracture toughness of the glass deduced from the failure map is 0.85 MPa m1/2, in line with the reported value of 0.80 MPa m1/2. The results in this study clearly indicate that the combinatorial edge delamination test can be used to predict the reliability of bond joint as a function of film thickness and temperature and quantify the bond strength in a fast and accurate manner.
Citation
Journal of the American Chemical Society
Volume
16

Keywords

bond strength, combinatorial edge delamination test, epoxy/glass, fracture toughness

Citation

Chiang, M. , Kawaguchi, D. and Stafford, C. (2005), Combinatorial Approaches for Characterizing Thin Film Bond Strength, Journal of the American Chemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852505 (Accessed October 2, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created December 31, 2004, Updated October 12, 2021
Was this page helpful?