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Combinatorial Approach to the Edge Eelamination Test for Thin FilmReliability Adaptability and Variability



Martin Y. Chiang, R Song, A J. Crosby, Alamgir Karim, C. K. Chiang, Eric J. Amis


We have demonstrated the adaptability and variability of a newly developed combinatorial edge delamination test. This was accomplishedthrough studying the effect of substrate surface energy on the adhesion of thin films. In this combinatorial approach, a library (a singlespecimen) was fabricated with a polymethyl methacrylate (PMMA) film on a silicon substrate. The film has thickness gradient in onedirection and the substrate has an orthogonal surface energy gradient. The thickness gradient was produced with a flow coating technique,and the surface energy gradient was controlled by partial oxidation of an alkylsilane layer on a silicon wafer. Applying a constant temperatureto the specimen, interfacial debonding events were observed and a distribution of failure was constructed. Our results demonstrate theproposed combinatorial methodology for rapidly and efficiently evaluating the adhesion of general film/substrate systems as a function ofmany controllable parameters. In addition, this methodology can be used to predict the reliability distributions of the adhesion for practical parameters.
Thin Solid Films


adhesion, combinatorial methods, Contact angle, Surface energy, thin film reliability


Chiang, M. , Song, R. , Crosby, A. , Karim, A. , Chiang, C. and Amis, E. (2005), Combinatorial Approach to the Edge Eelamination Test for Thin FilmReliability Adaptability and Variability, Thin Solid Films, [online], (Accessed May 20, 2024)


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Created January 1, 2005, Updated February 19, 2017