Combinatorial Approach to the Edge Eelamination Test for Thin FilmReliability Adaptability and Variability
Martin Y. Chiang, R Song, A J. Crosby, Alamgir Karim, C. K. Chiang, Eric J. Amis
We have demonstrated the adaptability and variability of a newly developed combinatorial edge delamination test. This was accomplishedthrough studying the effect of substrate surface energy on the adhesion of thin films. In this combinatorial approach, a library (a singlespecimen) was fabricated with a polymethyl methacrylate (PMMA) film on a silicon substrate. The film has thickness gradient in onedirection and the substrate has an orthogonal surface energy gradient. The thickness gradient was produced with a flow coating technique,and the surface energy gradient was controlled by partial oxidation of an alkylsilane layer on a silicon wafer. Applying a constant temperatureto the specimen, interfacial debonding events were observed and a distribution of failure was constructed. Our results demonstrate theproposed combinatorial methodology for rapidly and efficiently evaluating the adhesion of general film/substrate systems as a function ofmany controllable parameters. In addition, this methodology can be used to predict the reliability distributions of the adhesion for practical parameters.
, Song, R.
, Crosby, A.
, Karim, A.
, Chiang, C.
and Amis, E.
Combinatorial Approach to the Edge Eelamination Test for Thin FilmReliability Adaptability and Variability, Thin Solid Films, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852545
(Accessed September 26, 2023)