As the applications for 3D imaging systems continue to grow, the need for standards to evaluate these systems has become more critical. The ASTM E57 3D Imaging committee established in 2006 was formed specifically to develop standard terminology, test methods, best practices and data interoperability specifications for these instruments. The scope statement for E57 is as follows: The development of standards for 3D imaging systems, which include, but are not limited to, laser scanners (also known as LADAR or laser radars) and optical range cameras (also known as flash LIDAR or 3D range camera). The initial focus will be on specification and performance evaluation standards for 3D imaging systems for applications including, but not limited to: construction and maintenance, surveying, mapping and terrain characterization, manufacturing (e.g., aerospace, shipbuilding, etc.), transportation, mining, mobility, historic preservation, forensics. Standard test methods for the performance evaluation of 3D imaging systems will provide a basis for fair comparisons of instruments, provide assurance that an instrument will meet certain criteria, reduce the confusion regarding terminology, and increase user confidence in the applications of these systems. Best practices will improve product quality and will ensure a minimum level of performance. Data interoperability will ensure the seamless transfer of data between software applications. Current subcommittees of ASTM E57 are working on standards for terminology (E57.01), test methods (E57.02), data interoperability (E57.04), and best practices (E57.03). Full committee meetings are regularly held in January and again in June of each year. Subcommittees meet more frequently, most often via teleconference. Because the standards and documents produced by ASTM E57 can have wide-ranging impacts - for example how manufacturer specifications are written, how customers decide on which instruments to purchase, and how contractual language for 3D imaging services are specified - input and participation from the larger 3D imaging community is actively sought.