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Application of a CMP Model to Tungsten CMP

Author(s)

E W. Paul

Abstract

A general model of chemical mechanical polishing (CMP) has been derived which shows the dependence of the polishing rate on the concentration of chemicals and abrasives in the slurry. This paper applies the model to tungsten CMP and describes the chemistry of tungsten CMP in some detail.
Citation
Journal of Electrical Chemical Science

Keywords

CMP, model, Tungsten
Created August 26, 2016, Updated February 17, 2017