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Alloy Selection



C A. Handwerker, Ursula R. Kattner, Kil-Won Moon, J Bath, E -. Bradley, P Snugovsky


In this chapter, the key results and analyses leading to the choice of tin-silver-copper alloys by NEMI as the new national standard Pb-free solder system are discussed in detail. These include data on phase transformations in solders (including melting behavior, solidification pathways and interface reactions with substrate and lead materials), on wetting behavior, and mechanical properties (including thermomechanical fatigue). Open questions are discussed.


electronic packaging, environmentally friendly electronics, lead-free solders, NEMI, ROHS, solders, WEEE


Handwerker, C. , Kattner, U. , Moon, K. , Bath, J. , Bradley, E. and Snugovsky, P. (2008), Alloy Selection, IEEE (Accessed July 18, 2024)


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Created October 16, 2008