C A. Handwerker, Ursula R. Kattner, Kil-Won Moon, J Bath, E -. Bradley, P Snugovsky
In this chapter, the key results and analyses leading to the choice of tin-silver-copper alloys by NEMI as the new national standard Pb-free solder system are discussed in detail. These include data on phase transformations in solders (including melting behavior, solidification pathways and interface reactions with substrate and lead materials), on wetting behavior, and mechanical properties (including thermomechanical fatigue). Open questions are discussed.