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Alloy Selection

Published

Author(s)

C A. Handwerker, Ursula R. Kattner, Kil-Won Moon, J Bath, E -. Bradley, P Snugovsky

Abstract

In this chapter, the key results and analyses leading to the choice of tin-silver-copper alloys by NEMI as the new national standard Pb-free solder system are discussed in detail. These include data on phase transformations in solders (including melting behavior, solidification pathways and interface reactions with substrate and lead materials), on wetting behavior, and mechanical properties (including thermomechanical fatigue). Open questions are discussed.
Citation
IEEE

Keywords

electronic packaging, environmentally friendly electronics, lead-free solders, NEMI, ROHS, solders, WEEE

Citation

Handwerker, C. , Kattner, U. , Moon, K. , Bath, J. , Bradley, E. and Snugovsky, P. (2008), Alloy Selection, IEEE (Accessed July 18, 2024)

Issues

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Created October 16, 2008