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Thomas H. Gnaupel-Herold (Fed)

Publications

Bottom-up Au Filling of Trenches in Curved Wafers

Author(s)
Daniel Josell, Thomas P. Moffat, Thomas Gnaupel-Herold, David Raciti, Martin Stauber, Yu Q, Liyang Chen, M Rawlik, Marco Stampanoni, Lucia Romano
A 〖Bi〗^(3+)-stimulated Au electrodeposition process in slightly alkaline 〖Na〗_3 Au(〖SO〗_3 )_2+〖Na〗_2 〖SO〗_3 electrolytes has been previously demonstrated for

Two Stage Forming: Experimental and FE Analysis

Author(s)
M C. Oliveira, A J. Baptista, J L. Alves, L F. Menezes, D E. Green, Thomas H. Gnaupel-Herold, Mark Iadicola, Timothy J. Foecke, T B. Stoughton
One of the present challenges in sheet metal forming is to simulate sequential production stages, from the initial blank sheet to the final part ready for
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Created October 9, 2019, Updated December 8, 2022
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