The team is recognized for a seven-year program to develop a world-class superconducting interconnect process to provide microscopic, resistance-free electrical connections between circuits on separate chips to enable complex three-dimensional devices. The work required the acquisition of new equipment, modification of existing equipment, and extensive process and measurement development. New capabilities in astrophysics, quantum science, and other areas are the result. The effort will have impact for decades and represents a model for cooperation among a research facility and its user groups.