Skip to main content

NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

NanoFab Tool: Harrick Plasma PDC-32 Plasma Bonder

harrick_plasma

The Harrick Plasma PDC-32 plasma bonder is used to remove fine particles on user substrates prior to release agent treatment and to modify the surface bonds of a polydimethylsiloxane (PDMS) mold to promote permanent bonding of the mold to a substrate.The plasma bonder supports substrates ranging from 75 mm wafers down to small pieces.

Specifications/Capabilities

  • Maximum RFpower: 18 W.
  • Adjustable RFpower: Three settings for low, medium, and high power.
  • Metered gasflow.

Usage Information

Supported Sample Sizes

  • Maximum wafer diameter: 75 mm (3 in).
  • Small pieces supported: Yes.

Typical Applications

  • Pre-silanization clean.
  • PDMS surface activation for bonding.
  • Microfluidic device fabrication.
Created February 11, 2015, Updated March 3, 2025
Was this page helpful?