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NanoFab Tool: Harrick Plasma PDC-32 Plasma Bonder

harrick_plasma

The Harrick Plasma PDC-32 plasma bonder is used to remove fine particles on user substrates prior to release agent treatment and to modify the surface bonds of a polydimethylsiloxane (PDMS) mold to promote permanent bonding of the mold to a substrate.The plasma bonder supports substrates ranging from 75 mm wafers down to small pieces.

Specifications/Capabilities

  • Maximum RFpower: 18 W.
  • Adjustable RFpower: Three settings for low, medium, and high power.
  • Metered gasflow.

Usage Information

Supported Sample Sizes

  • Maximum wafer diameter: 75 mm (3 in).
  • Small pieces supported: Yes.

Typical Applications

  • Pre-silanization clean.
  • PDMS surface activation for bonding.
  • Microfluidic device fabrication.
Created February 11, 2015, Updated November 21, 2019