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|Author(s):||A Bard; K K. Berggren; J L. Wilbur; John D. Gillaspy; S L. Rolston; Jabez J. McClelland; William D. Phillips; M Prentiss; G M. Whitesides;|
|Title:||Self-Assembled Monolayers Exposed by Metastable Argon and Metastable Helium for Neutral Atom Lithography and Atomic Beam Imaging|
|Published:||September 01, 1997|
|Abstract:||We used a beam of noble gas atoms in a metastable excited state to expose a thin (1.5nm self-assembled monolayer resist applied over a gold-coated silicon wafer. We determined exposure damage as a function of dose of metastable atoms by processing the samples in a wet-chemical etch to remove the gold from unprotected regions, and then measuring the reflectivity with a laser and observing the microstructure with an atomic force microscope. We found that the minimum dose required to damage the resist substantially was 1.7(3) x 1015 atoms/cm2 for metastable helium, and 25(7) x 1015 atoms/cm2 for metastable argon.|
|Citation:||Journal of Vacuum Science and Technology B|
|Research Areas:||Nanofabrication, Nanomanufacturing, and Nanoprocessing|