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971. Summary Report of NIST/MSC Workshop on Traceability in Length
Series: NIST Interagency/Internal Report (NISTIR)
Report Number: 6149
Topic: Manufacturing
Published: 4/1/1998
Author: Dennis A Swyt
Abstract: The National Institute of Standards and Technology, in conjunction with the Measurement Science Conference, conducted an industry-needs workshop on February 4, 1998, on issues with U.S. manufacturing companies, particularly smaller ones, may have in ...

972. The Estimation of Measurement Uncertainty of Small Circular Features Measured by Coordinate Measuring Machines
Topic: Manufacturing
Published: 4/1/1998
Authors: Steven David Phillips, Bruce R. Borchardt, William Tyler Estler, J Buttress
Abstract: This paper examines the measurement uncertainty of small circular features as a function of the sampling strategy; i.e., the number and distribution of measurement points. Specifically, we examine measuring a circular feature using a three-point samp ...

973. Final Report, 1997-1998 NIST/SEMATECH Collaboration for Improvement of High-Accuracy Critical-dimension Metrology for Semiconductor Manufacturing
Topic: Manufacturing
Published: 3/30/1998
Authors: Andras Vladar, Michael T Postek
Abstract: Beginning on or about April 1, 1997, the National Institute of Standards and Technology (NIST) received partial support from SEMATECH to collaborate in a program designated 1997-1998 NIST/SEMATECH Collaboration for Improvement of High-Accuracy Critic ...

974. Analytical/Experimental Study of Vibration of a Room-Sized Airspring-Supported Slab
Topic: Manufacturing
Published: 3/1/1998
Authors: H Amick, B Sennewald, E Clayton Teague, Brian R Scace
Abstract: This paper reports the results of the finite element analysis and in-situ testing of a large-scale (4 m x 10 m) pneumatically isolated concrete slab are reported. The slab was constructed as a design prototype for next generation metrology laboratori ...

975. Influence of Data Analysis and Other Factors on the Short-term Stability of Vertical Scanning-Probe Microscope Calibration Measurements
Topic: Manufacturing
Published: 3/1/1998
Authors: H Edwards, J Jorgensen, John A Dagata, Y Strausser, J Schneir
Abstract: We report a study of a fundamental limit to the accuracy of vertical measurements made using scanning-probe microscopes (SPM): the short-term stability of a vertical calibration using a waffle-pattern artifact. To test the instrumental component of t ...

976. Round Robin Determination of Power Spectral Densities of Different Si Wafer Surfaces
Topic: Manufacturing
Published: 3/1/1998
Authors: Egon Marx, I J Malik, Y Strausser, T Bristow, N Poduje, J C Stover
Abstract: Power spectral densities (PSDs) were used to characterize a set of surfaces over a wide range of lateral as well as perpendicular dimensions. Twelve 200-mm-diameter Si wafers were prepared and the surface finishes ranged from as-ground wafers to epit ...

977. Tip Characterization for Scanned Probe Microscope Width Metrology
Topic: Manufacturing
Published: 3/1/1998
Authors: Samuel Dongmo, John S Villarrubia, Samuel N Jones, Thomas B Renegar, Michael T Postek, Jun-Feng Song
Abstract: Determination of the tip shape is an important prerequisite for converting the various scanning probe microscopies form imaging tools into dimensional metrology tools with sufficient accuracy to meet the critical dimension measurement requirements of ...

978. Uncertainty Analysis for Angle Calibrations Using Circle Closure
Series: Journal of Research (NIST JRES)
Topic: Manufacturing
Published: 3/1/1998
Author: William Tyler Estler

979. Uncertainty Analysis for Angle Calibrations Using Circle Closure
Topic: Manufacturing
Published: 3/1/1998
Author: William Tyler Estler
Abstract: We analyze two types of full-circle angle calibrations: a simple closure in which a single set of unknown angular segments is sequentially compared with an unknown reference angle, and a dual closure in which two divided circles are simultaneously ca ...

980. Growth and Analysis of Near Ideal Thin Films and Multilayers
Topic: Manufacturing
Published: 2/18/1998
Authors: J Pedulla, R Deslattes, S Owens
Abstract: As thin film technology moves into the truly nano-scale region [<10 nm], many conventional methods of growth and analysis of thin films and multilayers break down due to large levels of interfacial roughness and diffusion, or incompatibility of the a ...

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