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Topic Area: Nanomanufacturing

Displaying records 51 to 60 of 73 records.
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51. High resolution full-field imaging of nanostructures using compact extreme ultraviolet lasers
Topic: Nanomanufacturing
Published: 7/21/2008
Authors: Norman A Sanford, F Brizuela, Kristine A Bertness
Abstract: Recent advances in the development of high peak brightness table-top extreme ultraviolet (EUV) and soft x-ray (SRX) lasers have opened new opportunities for the demonstration of compact full-field EUV/SXR microscopes capable of capturing images with ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908697

52. Reducing Thermal Noise in Molecular Force Spectroscopy
Topic: Nanomanufacturing
Published: 6/2/2008
Author: Gordon Allan Shaw
Abstract: Molecular force spectroscopy is the practice of testing the mechanical properties of single molecules.  The precision determination of these properties requires an instrument capable of piconewton-level force measurement.  The atomic force ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=824638

53. Optical Through-Focus Technique that Differentiates Small Changes in Line Width, Line Height and Sidewall Angle for CD, Overlay, and Defect Metrology Applications
Topic: Nanomanufacturing
Published: 4/16/2008
Authors: Ravikiran Attota, Richard M Silver, Bryan M Barnes
Abstract: We present a new optical technique for dimensional analysis of sub 100 nm sized targets by analyzing through-focus images obtained using a conventional bright-field optical microscope.  We present a method to create through-focus image maps (TFIM) us ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=824634

54. Towards Accurate Feature Shape Metrology
Topic: Nanomanufacturing
Published: 3/22/2008
Authors: Ndubuisi George Orji, Ronald G Dixson, B Bunday, J Allgair
Abstract: Over the last few years, the need for shape metrology for process control has increased. A key component of shape metrology is sidewall angle (SWA). However, few instruments measure SWA directly. The critical dimension atomic force microscope (CD-AFM ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=824629

55. A Characterization of Probe Dynamic Behaviors in Critical Dimension Atomic Force Microscopy
Topic: Nanomanufacturing
Published: 3/17/2008
Authors: Shaw C Feng, Che B. Joung, Theodore Vincent Vorburger
Abstract: Critical Dimension (CD) Atomic Force Microscopy (AFM) is a primary means to measure the geometric shapes of walls and trenches on the nanometer scale in laboratories supporting the electronic industry. However, with CD-AFM, it is difficult to predict ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=824625

56. Integration, Interoperability, and Information Management: What are the Key Issues to Nanomanufacturing?
Topic: Nanomanufacturing
Published: 9/1/2007
Author: Kevin W Lyons
Abstract: Nanomanufacturing can be defined as all manufacturing activities that collectively support an approach to design, produce, control, modify, manipulate, and assemble nanometer scale objects and features for the purpose of fabricating a product or syst ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=822744

57. Computational Models of the Nano Probe Tip for Static Behaviors
Topic: Nanomanufacturing
Published: 6/1/2007
Authors: Shaw C Feng, Theodore Vincent Vorburger, Che B. Joung, Li Ma
Abstract: As integrated circuits become smaller and faster, the measurement of line width must have less uncertainty and more versatility. The common requirement for uncertainty is less than 10 nanometers. The industrial need for versatility is three dimension ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=822327

58. Computational Models of the Nana Probe Tip for Static Behaviors (Abstract Only)
Topic: Nanomanufacturing
Published: 2/1/2007
Authors: Shaw C Feng, Theodore Vincent Vorburger, Che B. Joung, Joseph Fu, Ronald G Dixson, Li Ma
Abstract: As integrated circuits become smaller and faster, the measurement of line width must have less uncertainty and more versatility. The common requirement for uncertainty is less than 10 nanometers. The industrial need for versatility is three dimension ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=822658

59. Manufacture and Metrology of 300 mm Silicon Wafers with Ultra-Low Thickness Variations
Report Number: 823030
Topic: Nanomanufacturing
Published: 1/2/2007
Authors: Ulf Griesmann, Quandou Wang, Marc Tricard, Paul Dumas, Christopher Hill
Abstract: With the evolution of exposure tools for optical lithography towards larger numerical apertures, the semiconductor industry expects continued demand for improved wafer flatness at the exposure site. The Allowable site flatness for 300 mm wafers is ex ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=823030

60. Control of MEMS Nanopositioners With Nano-Scale Resolution
Topic: Nanomanufacturing
Published: 11/10/2006
Authors: Jason John Gorman, Yong Sik Kim, Nicholas G Dagalakis
Abstract: Several approaches for the precision control of micro-scale positioning mechanisms, or MEMS nanopositioners, are presented along with initial experimental results which demonstrate nano-scale positioning resolution. The MEMS nanopositioners discussed ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=823602



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