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Author: yaw obeng
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1. A Case Study on the Impact of Local Material Chemistry on the Mechanical Reliability of Packaged Integrated Circuits: Correlation of the Packaging Fallout to the Chemistry of Passivation Dielectrics in an Al-Cu System
Published: 3/19/2012
Authors: Chukwudi Azubuike Okoro, Yaw S Obeng
Abstract: In this paper, we use a variety of analytical techniques to examine the impact of local chemistry, and the mechanical properties, of the encapsulation dielectric films on the post-packaging device rejection rate of integrated circuit devices. A stro ...

2. A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability
Published: 1/1/2014
Authors: Chukwudi Azubuike Okoro, June Waiyin Lau, Yaw S Obeng, Klaus Hummler
Abstract: In this work, a detailed failure analysis of the physical root cause for the increase in electrical resistance and radio-frequency (RF) transmission coefficient of through-silicon via (TSV) daisy chain was investigated. Six different failure modes we ...

3. Accelerated Stress Test Assessment of Through-Silicon Vias Using RF Signals
Published: 6/1/2013
Authors: Chukwudi Azubuike Okoro, Pavel Kabos, Jan Obrzut, Klaus Hummler, Yaw S Obeng
Abstract: In this work, radio frequency (RF) signal is demonstrated as an effective metrology tool for the assessment of the effect of thermal cycling on the reliability of through-silicon via (TSV) stacked dies. It was found that RF signal integrity of TSV da ...

4. Advanced Metrology for Nanoelectronics at the National Institute of Standards and Technology
Published: 3/11/2009
Authors: Joaquin (Jack) Martinez, Yaw S Obeng, Stephen Knight
Abstract: A broad range of programs at the National Institute of Standards and Technology address critical metrology and characterization challenges facing the nanoelectronics industry. A brief history of the program will be included. From these programs we ...

5. Back-End-of-Line Test Structure Design and Simulation for Subsurface Metrology with Scanning Probe Microscopy
Published: 12/13/2013
Authors: Lin You, Emily Hitz, Jungjoon Ahn, Yaw S Obeng, Joseph J Kopanski
Abstract: As demands in the semiconductor industry call for further miniaturization and performance enhancement of electronic systems, the traditional planar (2D) electronic interconnection and packaging technologies show their difficulties in meeting the ...

6. Development of a Methodology to Determine Risk of Counterfeit Use
Published: 6/5/2013
Authors: Mark Schaffer, Yaw S Obeng
Abstract: Counterfeit components have become a multi-million dollar, yet undesirable, part of the electronics industry. The profitability of the counterfeit industry rests in large part on its ability to recognize supply constraints and quickly respond, effect ...

7. ECS Transactions
Published: 5/18/2008
Authors: Yaw S Obeng, Stephen Knight, Joaquin (Jack) Martinez
Abstract: Nanoelectronics require the introduction of several new uncharacterized material(s) combinations and new processing techniques. The critical metrology and characterization needs of the nanoelectronics industry are being addressed with a broad range o ...

8. Graphene - Is it the future for Semiconductors? A High Level Overview of Materials, Devices and Applications.
Published: 4/11/2011
Authors: Yaw S Obeng, P Srinivasan
Abstract: In this paper, we attempt to summarize the graphene component of the first two of the GRAPHENE, Ge/III-V AND EMERGING MATERIALS FOR POST-CMOS APPLICATIONS symposia [1, 2]. While not exhaustive and complete, a review of the papers presented at these s ...

9. Graphene, Ge/III-V, Nanowires and Emerging Materials for Post-CMOS Applications 3 -and- Tutorials in Nanotechnology: Dielectrics in Nanosystems
Published: 4/21/2011
Authors: Alamgir Karim, Veena Misra, G. Srinivasan, Yaw S Obeng, S De Gendt
Abstract: This issue of ECS Transactions will cover the following topics in (a) Graphene Material Properties, Preparation, Synthesis and Growth; (b) Metrology and Characterization of Graphene; (c) Graphene Devices and Integration; (d) Graphene Transport and mo ...

10. Identity management standards for product life cycle of electronic parts
Published: 9/10/2008
Authors: YaShian Li-Baboud, Eric D Simmon, Yaw S Obeng
Abstract: The high profit opportunities, the diffused outsourcing of manufacturing and the structure of distribution networks make the electronics and its components susceptible to counterfeiting. Distinguishing the genuine article from counterfeit is increasi ...

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