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Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects (
The NIST Ac-dc 2 Difference Project performs leading edge measurement services and research for ac-dc difference measurements and dc voltage metrology. We
The objective for Advanced IC Interconnects is to provide measurement standards and advanced measurement methods supporting metrology needs of the semiconductor
Electron, ion and photon-based microanalysis methods, instrumentation and protocols are developed to advance measurement science towards the elemental and
In this project we measure the fundamental electrical properties of materials from bulk to nanoscale from 1 MHz to 0.3 THz. Understanding the interaction of
We develop methods to evaluate the mechanical behavior of micro- and mesoscale metal alloys to fracture, and Micro Electro Mechanical Systems (MEMS) materials
The semiconductor industry continues to push for smaller features, more integration, and increased yield. New photoresist chemistries and advances in extreme
Research on quantum information (QI) seeks to control and exploit exotic properties of quantum mechanics, and researchers are already generating "unbreakable"
The exponential growth in the power electronics market requires efficient devices based on wide bandgap (WBG) semiconductors. The yield of power devices is
To process information from quantum circuits and systems, it is important to have amplifiers with wide bandwidth, high dynamic range, and extremely low noise
Transmission electron imaging and diffraction in an SEM are powerful tools that can be utilized in settings ranging from academia to small business, to
Antennas are the eyes, ears and voice boxes of everything from cell phones to interplanetary spacecraft. The Antenna Metrology Program carries on NIST's
The semiconductor industry requires sub-nanometer, 3-dimensional quantitative elemental mapping of materials, nanoscale structures, and devices with high
This project employs a causal Green’s function (CGF) method to model thermal transport in nanoscale semiconductors, overcoming limitations posed by the Fourier
An accurate characterization of how the wireless signal propagates through different environments and frequency bands, is key to developing radio frequency (RF)
Some of the manufacturing difficulties encountered by the heterogeneous integration of modular chips in system-in-package are due to thermal management and
This project focuses on understanding the potential for nanoscale engineered materials to advance state-of-the-art spectroscopic techniques and foster the
The semiconductor industry is in need of new, high throughput in-line dimensional metrology methods to characterize next generation 3D nanostructures. The
Optical systems that operate at wavelengths in the ultraviolet (UV) and extreme-ultraviolet (EUV) are susceptible to degradation by a number of different
The Sensor Readout Project within the Quantum Electronics Group leverages the sensitivity of superconducting quantum interference devices (SQUIDs), low-noise
The Dynamic EUV Imaging and Spectroscopy for Microelectronics program in the Spin Electronics group makes use of an ultra-fast, coherent, extreme ultraviolet
An urgent objective of the microelectronics industry is to mitigate the extreme heat densities generated within devices that are limiting the performance of
The goal of this project is to extend and improve the measurements of the key climate record of the long-term balance between Earth absorption of solar energy