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Displaying records 681 to 690 of 739 records.
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681. The National Ballistics Imaging Comparison (NBIC) Project
Topic: Electronics & Telecommunications
Published: 3/10/2012
Authors: Jun-Feng Song, Theodore Vincent Vorburger, Susan M Ballou, Robert Meryln Thompson, James H Yen, Thomas B Renegar, Xiaoyu A Zheng, Richard M Silver, Martin Ols
Abstract: In response to the guidelines issued by the ASCLD/LAB-International (American Society of Crime Laboratory Directors/Laboratory Accreditation Board) to establish traceability and quality assurance in U.S. crime laboratories, a NIST/ATF joint project e ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907871

682. The OATS Method Revisited
Topic: Electronics & Telecommunications
Published: 4/1/2005
Authors: Christopher L Holloway, Perry F. Wilson, Robert German
Abstract: Open area test sites (OATS) or equivalent semi-anechoic chambers are the most commonly used sites for EMC emissions tests. This article discusses the origins of this test methodology and revisits the interference problem (broadcast media) that the OA ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=31981

683. The Prediction of Permeability for an Epoxy/E-Glass Composite Using Optical Coherence Tomographic Images
Topic: Electronics & Telecommunications
Published: 12/1/2001
Authors: Joy P Dunkers, Frederick R Phelan Jr, C G Zimba, Kathleen M. Flynn, D P Sanders, R C Peterson, Richard~undefined~undefined~undefined~undefined~undefined Parnas
Abstract: Knowledge of the permeability tensor in liquid composite molding is important for process optimization. Unfortunately, experimental determination of permeability is difficult and time consuming. A rapid, non-destructive technique called optical coh ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851606

684. The Role of Carrier Lifetime in Forward Bias Degradation of 4H-SiC PiN Diodes
Topic: Electronics & Telecommunications
Published: 10/5/2003
Authors: Allen R Hefner Jr, Ty R. McNutt, David W. Berning, Ranbir Singh, Adwoa Akuffo
Abstract: Abstract. The role of excess carrier lifetime reduction in the mechanism for on-state voltage (Vf) degradation of high voltage 4H-SiC PiN diodes is investigated. A method is developed to electrically monitor the emitter, base, and end region excess c ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=31552

685. The Single Fiber Composite Test:A Comparison of E-Glass Fiber Fragmentation Data With Statistical Theories
Topic: Electronics & Telecommunications
Published: 3/22/2010
Authors: Gale Antrus Holmes, Jae Hyun Kim, Stefan D Leigh, Walter G McDonough
Abstract: The exact theories advanced by Curtin et al. (1991) and Hui, Phoenix, et al. (1995) to describe the fiber break evolution process in single fiber composites were found to be incorrect when compared to experimental data. In contrast to theoretical ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852782

686. The Stability of Retinol, {alpha}-Tocopherol, trans-Lycopene, and trans-{beta}-Carotene in Liquid-Frozen and Lyophilized Serum
Topic: Electronics & Telecommunications
Published: 8/10/1998
Authors: Jeanice M Brown Thomas, David Lee Duewer, Margaret C Kline, Katherine E Sharpless
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=901571

687. The design, construction and application of a large aperture lens-less line-focus PVDF transducer
Topic: Electronics & Telecommunications
Published: 1/1/1996
Authors: D Xiang, Gerald V. Blessing, Nelson N. Hsu
Abstract: A large aperture lens-less line-focus transducer for materials characterization is described. The transducer design is based on a time-domain Green?s function formalism, which also yields good theoretical corroboration of the experimental results. Th ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=820022

688. The evaluation of photo/e-beam complementary grayscale lithography for high topography 3D structure
Topic: Electronics & Telecommunications
Published: 3/29/2013
Authors: Liya Yu, Richard J Kasica, Robert Dennis Newby, Lei Chen, Vincent K Luciani
Abstract: This article demonstrates and evaluates photo/e-beam grayscale complementary lithography processes for the fabrication of large area, high topography grayscale structure. The combination of these two techniques capitalizes on the capability of photol ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=913677

689. The mechanisms of damage in ballistic fibers
Topic: Electronics & Telecommunications
Published: 9/13/2011
Authors: Walter G McDonough, Haruki Kobayashi, Jae Hyun Kim, Amanda Lattam Forster, Kirk D Rice, Gale Antrus Holmes
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908283

690. Thermal Component Models for Electro-Thermal Analysis of Multichip Power Modules
Topic: Electronics & Telecommunications
Published: 10/24/2002
Authors: J J. Rodriguez, John V. Reichl, Zharadeen Rodriguez Parrilla, Allen R Hefner Jr, David W. Berning, M Velez-Reyes, Jih-Sheng Lai
Abstract: Thermal component models are developed for multi-chip IGBT power electronic modules (PEM) and associated high-power converter heatsinks. The models are implemented in SABER and are combined with the electro-thermal IGBT and diode models to simulate t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=30113



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