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Displaying records 681 to 690 of 735 records.
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681. The Single Fiber Composite Test:A Comparison of E-Glass Fiber Fragmentation Data With Statistical Theories
Topic: Electronics & Telecommunications
Published: 3/22/2010
Authors: Gale Antrus Holmes, Jae Hyun Kim, Stefan D Leigh, Walter G McDonough
Abstract: The exact theories advanced by Curtin et al. (1991) and Hui, Phoenix, et al. (1995) to describe the fiber break evolution process in single fiber composites were found to be incorrect when compared to experimental data. In contrast to theoretical ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852782

682. The Stability of Retinol, {alpha}-Tocopherol, trans-Lycopene, and trans-{beta}-Carotene in Liquid-Frozen and Lyophilized Serum
Topic: Electronics & Telecommunications
Published: 8/10/1998
Authors: Jeanice M Brown Thomas, David Lee Duewer, Margaret C Kline, Katherine E Sharpless
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=901571

683. The design, construction and application of a large aperture lens-less line-focus PVDF transducer
Topic: Electronics & Telecommunications
Published: 1/1/1996
Authors: D Xiang, Gerald V. Blessing, Nelson N. Hsu
Abstract: A large aperture lens-less line-focus transducer for materials characterization is described. The transducer design is based on a time-domain Green?s function formalism, which also yields good theoretical corroboration of the experimental results. Th ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=820022

684. The evaluation of photo/e-beam complementary grayscale lithography for high topography 3D structure
Topic: Electronics & Telecommunications
Published: 3/29/2013
Authors: Liya Yu, Richard J Kasica, Robert Dennis Newby, Lei Chen, Vincent K Luciani
Abstract: This article demonstrates and evaluates photo/e-beam grayscale complementary lithography processes for the fabrication of large area, high topography grayscale structure. The combination of these two techniques capitalizes on the capability of photol ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=913677

685. The mechanisms of damage in ballistic fibers
Topic: Electronics & Telecommunications
Published: 9/13/2011
Authors: Walter G McDonough, Haruki Kobayashi, Jae Hyun Kim, Amanda Lattam Forster, Kirk D Rice, Gale Antrus Holmes
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908283

686. Thermal Component Models for Electro-Thermal Analysis of Multichip Power Modules
Topic: Electronics & Telecommunications
Published: 10/24/2002
Authors: J J. Rodriguez, John V. Reichl, Zharadeen Rodriguez Parrilla, Allen R Hefner Jr, David W. Berning, M Velez-Reyes, Jih-Sheng Lai
Abstract: Thermal component models are developed for multi-chip IGBT power electronic modules (PEM) and associated high-power converter heatsinks. The models are implemented in SABER and are combined with the electro-thermal IGBT and diode models to simulate t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=30113

687. Thermal Component Models for Electrothermal Network Simulation
Topic: Electronics & Telecommunications
Published: 12/31/1993
Authors: Allen R Hefner Jr, David L. Blackburn
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=23751

688. Thermal Component Models for Electrothermal Network Simulation
Topic: Electronics & Telecommunications
Published: 12/31/1994
Authors: Allen R Hefner Jr, David L. Blackburn
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=28551

689. Thermo-viscoelastic Analysis and Creep Testing of Ambient Cure Epoxy Adhesives Used in Construction Applications
Topic: Electronics & Telecommunications
Published: 7/30/2008
Authors: Joannie W Chin, Donald Lee Hunston, Aaron M Forster, Justin M Ocel, Jean Michel Hartmann, Paul Fuchs
Abstract: Epoxies are increasingly used in construction for structural applications and properties such as creep are very important. For this reason, the thermo-viscoelastic properties and creep response of two commercial, ambient cure structural epoxy adhesi ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=861549

690. Third-Round Report of the SHA-3 Cryptographic Hash Algorithm Competition
Series: NIST Interagency/Internal Report (NISTIR)
Report Number: 7896
Topic: Electronics & Telecommunications
Published: 11/15/2012
Authors: Shu-jen H Chang, Ray A Perlner, William Edward Burr, Meltem Sonmez Turan, John M Kelsey, Souradyuti Paul, Lawrence E Bassham
Abstract: The National Institute of Standards and Technology (NIST) opened a public competition on November 2, 2007 to develop a new cryptographic hash algorithm - SHA-3, which will augment the hash algorithms specified in the Federal Information Processing St ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=912724



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