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Topic Area: Nanofabrication, Nanomanufacturing, and Nanoprocessing
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Displaying records 21 to 30 of 101 records.
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21. Fabrication and characterization of nanostructured III-V thermoelectric materials
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 9/26/2013
Authors: Clint Joseph Novotny, Fred Sharifi
Abstract: Approximately two thirds of all fossil fuel used is lost as heat. Thermoelectric materials, which convert heat into electrical energy, may provide a solution to partially recover some of this lost energy. To date, most commercial thermoelectric mater ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914496

22. Fabrication and characterization of silicon-based molecular electronic devices
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 5/21/2011
Authors: Christina Ann Hacker, Michael A Walsh, Sujitra Jeanie Pookpanratana, Mariona Coll Bau, Curt A Richter
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908433

23. Fabrication of silicon-based Molecular Electronic Structures Using Flip Chip Lamination
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 1/19/2011
Authors: Christina Ann Hacker, Michael A Walsh, Mariona Coll Bau, Curt A Richter
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908430

24. Fabrication with Flip-Chip Lamination
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 11/15/2009
Authors: Mariona Coll Bau, Curt A Richter, Christina Ann Hacker
Abstract: Fabrication with Flip-Chip Lamination , Mariona Coll, DR Hines, CA Richter, CA Hacker, Nanotechnology colloquium, Wake Forest University, 11-09.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907071

25. Fabrication with Flip-Chip Lamination
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 10/15/2009
Authors: Mariona Coll Bau, Curt A Richter, Christina Ann Hacker
Abstract: Fabrication with Flip-Chip Lamination , Mariona Coll, DR Hines, CA Richter, CA Hacker, MRSEC surface physics colloquium, University of Maryland, College Park, 10-09.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907072

26. Flip Chip Lamination Approach to Fabricate Top Metal Contacts on Organic-based Devices
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 3/15/2010
Authors: Mariona Coll Bau, Oana Jurchescu, Nadine Emily Gergel-Hackett, Curt A Richter, Christina Ann Hacker
Abstract: Flip Chip Lamination approach to fabricate top metal contacts on organic-based devices ; M.Coll, O.D. Jurchescu, N. Gergel-Hackett, C.A. Richter, C,A, Hacker, American Physical Society (APS), March 2010, Portland, OR, USA (oral)
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907069

27. Flip Chip Lamination Approach to Fabricate Ultrasmooth Metal Contacts for Organic-based Electronic Device
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 6/4/2010
Authors: Mariona Coll Bau, Nadine Emily Gergel-Hackett, Oana Jurchescu, Curt A Richter, Christina Ann Hacker
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907066

28. Flip Chip Lamination to electrically contact organic single crystals on flexible substrates
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 4/20/2011
Authors: Oana Jurchescu, Brad Conrad, Christina Ann Hacker, David J Gundlach, Curt A Richter
Abstract: The fabrication of top metal contacts for organic electronics represents a challenge and has important consequences for electrical properties of such systems. We report a low cost and non-destructive printing process, Flip Chip Lamination (FCL), to f ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907524

29. GaN Nanowires Grown by Molecular Beam Epitaxy
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 8/1/2011
Authors: Kristine A Bertness, Norman A Sanford, Albert Davydov
Abstract: The unique properties of GaN nanowires grown by molecular beam epitaxy are reviewed. These properties include the absence of residual strain, exclusion of most extended defects, long photoluminescence lifetime, low surface recombination velocity,and ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=909502

30. Guided three-dimensional catalyst folding during Metal assisted Chemical Etching of Silicon
Topic: Nanofabrication, Nanomanufacturing, and Nanoprocessing
Published: 6/28/2011
Authors: Konrad Rykaczewski, Owen J. Hildreth, Ching P. Wong, Andrei G. Fedorov, John Henry j Scott
Abstract: In order to fabricate truly complex three-dimensional (3D) silicon nanostructures fabrication methods which expand beyond the concept of creation of straight 3D structures by direct extension of two dimensional (2D) patterns need to be developed. In ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908006



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