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Displaying records 31 to 33.
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31. Intermetallics Formation and Growth at the Interface of Tin-Based Solder Alloys and Copper Substrates
Topic: Metals
Published: 2/17/2003
Authors: Juan C Madeni, S X Liu, Thomas Allen Siewert
Abstract: Increasing concerns regarding environmental contamination is driving the soldering research community to develop lead-free solder alloys. Previous studies have shown that Sn-based alloys such as Sn-3.5Ag, Sn-0.7Cu, Sn-9Zn, and Sn-3.2Ag-O. ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851327

32. Application of an On-Line Weld Monitoring System
Topic: Metals
Published: 9/12/2002
Authors: Thomas Allen Siewert, Ivan Samardzic, Stefanija Klaric
Abstract: quisition analysis and real-time manipulation of the welding parameters offer added controls over the weld quality. Thanks to the continual development of information technology and electronics, it is possible to improve the systems for monitoring ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851294

33. Estimation of Process Stability in the MAG Welding Process by Monitoring the Welding Parameters
Topic: Metals
Published: 11/1/2001
Author: Thomas Allen Siewert
Abstract: This paper presents the distribution of the main welding parameters (welding voltage and welding current) for semiautomatic arc welding with the metal active gas (MAG) process, using both flux- cored and solid electrodes. Two different shielding fas ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851229



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