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Topic Area: Electric Power Metrology
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Displaying records 1 to 10 of 38 records.
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1. Accurate Modeling and Analysis of PWM Inverters for Electromagnetic Compatibility Performance Evaluation
Topic: Electric Power Metrology
Published: 12/31/1998
Authors: Huibin Zhu, Yi-hua Tang, Jih-Sheng Lai, Allen R Hefner Jr
Abstract: For the purpose of electromagnetic compatibility (EMC) performance investigation and prediction, accurate modeling and analysis are performed on IGBT PWM inverters. In this paper, parasitic components and their measurement methods are addressed. Mo ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=8500

2. Automated Parameter Extraction Software for Silicon and High-Voltage Silicon Carbide Power Diodes
Topic: Electric Power Metrology
Published: 6/24/2010
Authors: Nanying Yang, Tam Hoang Duong, Jeong-O Jeong, Jose Miguel Ortiz, Allen R Hefner Jr, Kathleen Meehan
Abstract: This paper presents an automated parameter extraction software tool developed for constructing Silicon (Si) and Silicon Carbide (SiC) power diode models, which is called DIode Model Parameter extrACtion Tools (DIMPACT). This software tool extracts th ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=905858

3. Calibration of a Long-Wavelength Acoustic Flowmeter Using a Lumped Impedance Acoustic Model
Topic: Electric Power Metrology
Published: 8/26/2013
Authors: Lee James Gorny, Keith A Gillis, Michael R Moldover
Abstract: As a part of NIST‰s program to standardize measurements of greenhouse gas emissions, we are developing long-wavelength acoustic flowmeter (LWAF) for accurate, economical measurement of flue gas flows, for example, from coal-burning power plants. A L ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914137

4. Comparison of Au-In Transient Liquid Phase Bonding Designs for SiC Power Semiconductor Device Packaging
Topic: Electric Power Metrology
Published: 7/18/2011
Authors: Brian Joseph Grummel, Z. John Shen, Allen R Hefner Jr
Abstract: Transient liquid phase (TLP) bonding is an advanced die-attach technique for wide-bandgap power semiconductor and high-temperature packaging. TLP bonding advances current soldering techniques by raising the melting point to over 500 °C without detrim ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=909898

5. Computer-Controlled Thermal Cycling Tool to Aid in SiC Module Package Characterization
Topic: Electric Power Metrology
Published: 6/30/2010
Authors: Madelaine Herminia Hernandez, Jose Miguel Ortiz, Brian Joseph Grummel, Allen R Hefner Jr, David W. Berning, Colleen E. Hood, Patrick McCluskey
Abstract: A software-controlled thermal cycling test system developed for SiC module package characterization is presented. Its interface permits the flexible definition of testing parameters like variable data acquisition rates and customizable cycle transiti ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=905974

6. Consumer Power Quality Problems: Troubleshooting by Telephone
Topic: Electric Power Metrology
Published: 1/1/2002
Author: Francois D. Martzloff
Abstract: A tutorial document intended for use by utility customer service personnel in helping their customers trace the cause and find a possible remedy to equipment failure or malfunction.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=6550

7. Coordination and Acceleration of Smart Grid Interoperability Standards
Topic: Electric Power Metrology
Published: 5/6/2010
Author: Allen R Hefner Jr
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907118

8. Coordination and Acceleration of Smart Grid Interoperability Standards
Topic: Electric Power Metrology
Published: 5/11/2010
Author: Allen R Hefner Jr
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907119

9. Coordination and Acceleration of Smart Grid Interoperability Standards
Topic: Electric Power Metrology
Published: 5/20/2010
Author: Allen R Hefner Jr
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907120

10. Electrical and Thermal Characterization, Modeling, and Reliability Assessment of Power Semiconductor Modules
Topic: Electric Power Metrology
Published: 10/28/2009
Author: Allen R Hefner Jr
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=907113



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