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You searched on: Topic Area: Inorganic Analytical Chemistry Sorted by: title

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1. AN EXAMINATION OF METAL DEPOSITION DERIVED FROM AEROSPACE-RELATED ACTIVITY IN SEVERAL ENVIRONMENTAL MATRICES COLLECTED FROM WATERS SURROUNDING THE KENNEDY SPACE CENTER (KSC), FLORIDA
Topic: Inorganic Analytical Chemistry
Published: 4/8/2014
Authors: John A Bowden, Theresa M Cantu, Douglas M Scheidt, Russell H Lowers, Brian A Nocito, Vaneica Y Young, Louis J Guillette
Abstract: Metal deposition originating from anthropogenic activity was examined in a two-tier study using environmental samples collected from several locations at the Kennedy Space Center (KSC) and surrounding Merritt Island National Wildlife Refuge (MINWR) w ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914578

2. An Accurate and Sensitive Method for the Determination of Methylmercury in Biological Specimens Using GC-ICPMS with Solid Phase Microexctraction
Topic: Inorganic Analytical Chemistry
Published: 12/1/2004
Authors: William C Davis, Stacy S Vander-Pol, Michele M Schantz, Stephen E Long, Steven J Christopher
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=902461

3. An alternative method for the certification of the sulfur mass fraction in coal Standard Reference Materials
Topic: Inorganic Analytical Chemistry
Published: 6/1/2001
Authors: Michael R Winchester, William R. Kelly, Jacqueline L Mann, William F Guthrie, Bruce S MacDonald, Gregory C Turk
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=904897

4. Analyses of Thin Films and Surfaces by Cold Neutron Depth Profiling
Topic: Inorganic Analytical Chemistry
Published: 11/1/2004
Authors: George Paul Lamaze, Huaiyu H Chen-Mayer, K K Soni
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=903515

5. Analysis of lithium transport in electrochromic multilayer films by neutron depth profiling
Topic: Inorganic Analytical Chemistry
Published: 9/1/2000
Authors: George Paul Lamaze, Huaiyu H Chen-Mayer, A. Gerouki, R. B. Goldner
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=904536

6. Basic Steps Towards a Self-sustainable Quality System and Laboratory Accreditation
Topic: Inorganic Analytical Chemistry
Published: 5/1/1998
Authors: Peter Bode, K Heydorn, R W Innes, R Wood, Rolf Louis Zeisler
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=100772

7. Certification of NIST SRM 2569 Lead Paint Films for Children's Products
Topic: Inorganic Analytical Chemistry
Published: 10/15/2012
Authors: John L Molloy, John R Sieber, Karen E Murphy, Stephen E Long, Stefan D Leigh
Abstract: SRM 2569 Lead Paint Films for Children‰s Products is a new Standard Reference Material (SRM) developed for use primarily with XRF instrumentation. It consists of three paint coatings, with nominally 0 mg/kg, 90 mg/kg, and 300 mg/kg of Pb added, on p ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=909911

8. Certification of NIST Standard Reference Material 1575a Pine Needles and Results of an International Laboratory Comparison
Series: Journal of Research (NIST JRES)
Report Number: 260-156
Topic: Inorganic Analytical Chemistry
Published: 6/1/2004
Authors: Elizabeth A Mackey, Donald A. Becker, Rabia D. Oflaz, Robert Russ Greenberg, Richard Mark Lindstrom, Lee Lijian Yu, Laura J Wood, Stephen E Long, William R. Kelly, Jacqueline L Mann, Bruce S MacDonald, Stephen A. Wilson, Zoe A. Brown, Paul H. Briggs, James Budhan, Rick L Paul
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=903454

9. Certified Reference Materials for Microanalytical Methods
Topic: Inorganic Analytical Chemistry
Published: 2/15/2001
Authors: M. Rossbach, Rolf Louis Zeisler
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=904875

10. Characterization and Purification of Commercial SPS and MPS by Ion Chromatography and Mass Spectrometry
Topic: Inorganic Analytical Chemistry
Published: 1/21/2011
Authors: Ryan G. Brennan, Melissa Meaney Phillips, Liang Yueh Ou Yang, Thomas P Moffat
Abstract: SPS (bis-(3-sulfopropyl) disulfide) is an essential electrolyte additive used in the fabrication of copper interconnects by electrodeposition. The process is used over length scales ranging from on-chip Damascene wiring to through-silicon-vias for c ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906965



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