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You searched on: Author: Robert Keller

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1. Giant Secondary Grain Growth in Cu Films on Sapphire
Published: 8/1/2013
Authors: David L. Miller, Mark W Keller, Justin M Shaw, Katherine P. Rice, Robert R Keller, Kyle M. Diederichsen
Abstract: Single crystal metal films on insulating substrates are attractive for microelectronics and other applications, but they are difficult to achieve on macroscopic length scales. The conventional approach to obtaining such films is epitaxial growth at h ...

2. What's in a 'NYM?
Published: 7/1/2013
Author: Robert R Keller
Abstract: The field of electron microscopy, by its very diverse nature, abounds with acronyms: AEM, EF-TEM, ESEM, FE-SEM, HREM, HRTEM, HVEM, SEM, STEM, TEM, and VP-SEM, to name some instruments alone. Add in the different forms of data that these instrume ...

3. Transmission EBSD in the Scanning Electron Microscope
Published: 5/1/2013
Authors: Roy H. Geiss, Katherine P. Rice, Robert R Keller
Abstract: A new method for obtaining Kikuchi diffraction patterns from thin specimens in transmission has been developed for use in the SEM, scanning electron microscope, using a conventional electron backscatter diffraction (EBSD) detector and with a slight m ...

4. Epitaxial (111) Films of Cu, Ni, and Cu^dx^Ni^dy^ on {alpha}{long dash}Al^d2^O^d3^(0001) for graphene growth by chemical vapor deposition
Published: 9/21/2012
Authors: David L. Miller, Mark W Keller, Justin M Shaw, Ann Chiaramonti Chiaramonti Debay, Robert R Keller
Abstract: Films of (111)-textured Cu, Ni, and Cu^dx^Ni^dy^ were evaluated as substrates for chemical vapor deposition of graphene. A metal thickness of 400 nm to 700 nm was sputtered onto a substrate of {alpha}{long dash}Al^d2^O^d3^(0001) at temperatures of {I ...

5. Transmission EBSD-Like Patterns in the SEM for Nanoparticle and Ultrathin Film Analysis
Published: 3/1/2012
Authors: Robert R Keller, Roy H. Geiss
Abstract: We describe a new high-resolution scanning electron microscope method for measuring crystallographic information in nanoparticles and ultrathin films with dimensions down to 10 nm, through use of an electron backscatter diffraction (EBSD) detector. B ...

6. Electrical Reliability Testing of Single-Walled Carbon Nanotube Networks
Published: 5/18/2011
Authors: Mark C Strus, Ann Chiaramonti Chiaramonti Debay, Robert R Keller, Yung Joon Jung, Younglae Kim
Abstract: We present test methods to investigate the electrical reliability of nanoscale lines of highly-aligned, networked, metallic/semiconducting single-walled carbon nanotubes (SWCNTs) fabricated through a template-based fluidic assembly process. We find ...

7. Electromigration of Cu Interconnects Under AC and DC Test Conditions
Published: 5/15/2011
Authors: Robert R Keller, David Thomas Read, Roey Shaviv, Greg Harm, Sangita Kumari
Abstract: Electromigration of a 65 nm technology generation test vehicle was measured using DC, AC followed by DC, and three rectangular wave DC stressing conditions at 598 K. In some of the experiments samples were allowed to cool to room temperature between ...

8. Transmission Electron Diffraction from nanoparticles, nanowires and thin films in an SEM using conventional EBSD equipment
Published: 1/1/2010
Authors: Roy H. Geiss, Robert R Keller, David Thomas Read
Abstract: We describe a new scanning electron microscope (SEM) method for obtaining and analyzing the crystallographic structure and orientation in nanoparticles and ultrathin films using conventional electron backscatter diffraction (EBSD) equipment.

9. Metrologies for Mechanical Response of Micro- and Nanoscale Systems
Published: 1/1/2008
Authors: Robert R Keller, Donna C. Hurley, David Thomas Read, Paul Rice
Abstract: This chapter describes metrologies developed by NIST scientists and collaborators for mechanical properties of dimensionally-constrained materials; these approaches make use of methods inherently sensitive to small volumes. Attention is focused on d ...

10. Evaluation of Thin Film Mechanical Properties by Means of Electrical Test Methods
Published: 9/30/2007
Authors: Nicholas Barbosa, Robert R Keller, David Thomas Read, Richard P. Vinci
Abstract: The ability to measure the mechanical properties of thin films and small scale structures is essential in designing reliable components at the micro- and nano-scales. It is known that the mechanical properties of thin film materials deviate from rela ...

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  • SP 250-XX: Calibration Services
  • SP 260-XX: Standard Reference Materials
  • SP 300-XX: Precision Measurement and Calibration
  • SP 400-XX: Semiconductor Measurement Technology
  • SP 480-XX: Law Enforcement Technology
  • SP 500-XX: Computer Systems Technology
  • SP 700-XX: Industrial Measurement Series
  • SP 800-XX: Computer Security Series
  • SP 823-XX: Integrated Services Digital Network Series