NIST logo

Publications Portal

You searched on: Author: Richard Silver

Displaying records 1 to 10 of 118 records.
Resort by: Date / Title

1. Use of Bayesian Statistics to Improve Optical Measurement Uncertainty by Combined Multi-Tool Metrology
Published: 6/25/2015
Authors: Nien F Zhang, Richard M Silver, Hui Zhou, Bryan M Barnes
Abstract: Recently, there has been significant research investigating new optical technologies for dimensional metrology of features 32 nm in critical dimension and smaller. When modeling optical measurements a library of curves is assembled through the simula ...

2. Optimizing Hybrid Metrology: Rigorous Implementation of Bayesian and Combined Regression
Published: 3/19/2015
Authors: Mark Alexander Henn, Richard M Silver, Nien F Zhang, Hui Zhou, Bryan M Barnes, Bin Ming, Andras Vladar, John S Villarrubia
Abstract: Hybrid metrology, e.g. the combination of several measurement techniques to determine critical dimensions, is an important approach to meet the needs of semiconductor industry. A proper use of hybrid metrology may not only yield more reliable estimat ...

3. Effects of wafer noise on the detection of 20 nm defects using optical volumetric inspection
Published: 2/11/2015
Authors: Bryan M Barnes, Francois R. Goasmat, Martin Y Sohn, Hui Zhou, Andras Vladar, Richard M Silver
Abstract: Patterning imperfections in semiconductor device fabrication may either be noncritical [e.g., line edge roughness (LER)] or critical, such as defects that impact manufacturing yield. As the sizes of the pitches and linewidths decrease in lithography, ...

4. 193 nm scatterfield microscope illumination optics
Published: 12/17/2014
Authors: Martin Y Sohn, Richard M Silver
Abstract: A scatterfield microscope for deep sub-wavelength semiconductor metrology using 193 nm light has been designed. In addition to accommodating the fixed numerical aperture and size of its commercial catadioptric objective lens, the illumination optics ...

5. Pattern Transfer of Hydrogen Depassivation Lithography Patterns into Silicon with Atomically Traceable Placement and Size Control
Published: 7/17/2014
Authors: Josh Ballard, Stephen McDonnell, Don Dick, Maia Bischof, Joseph Fu, D Jaeger, James Owen , w Owen, Justin Alexander, Udi Fuchs, Pradeep Narayanan Namboodiri, Kai Li, John Randall, Robert Wallace, Yves Chabal, Richard Reidy, Richard M Silver
Abstract: Reducing the scale of etched nanostructures below the 10 nm range eventually will require an atomic scale understanding of the masks being used in order to maintain exquisite control over both feature size and feature density. Here, we demonstrate a ...

6. Optimizing Hybrid Metrology through a Consistent Multi-Tool Parameter Set and Uncertainty Model
Published: 4/14/2014
Authors: Richard M Silver, Bryan M Barnes, Nien F Zhang, Hui Zhou, Andras Vladar, John S Villarrubia, Regis J Kline, Daniel Franklin Sunday, Alok Vaid
Abstract: There has been significant interest in hybrid metrology as a novel method for reducing overall measurement uncertainty and optimizing measurement throughput (speed) through rigorous combinations of two or more different measurement techniques into a ...

7. Optical volumetric inspection of sub-20 nm patterned defects with wafer noise
Published: 4/2/2014
Authors: Bryan M Barnes, Francois R. Goasmat, Martin Y Sohn, Hui Zhou, Richard M Silver, Andras Vladar, Abraham Arceo
Abstract: We have previously introduced a new data analysis method that more thoroughly utilizes scattered optical intensity data collected during defect inspection using bright-field microscopy. This volumetric approach allows conversion of focus resolved 2-D ...

8. NIST SURFACE ROUGHNESS AND STEP HEIGHT CALIBRATIONS, Measurement Conditions and Sources of Uncertainty
Published: 3/18/2014
Authors: Theodore Vincent Vorburger, Thomas B Renegar, Xiaoyu A Zheng, Jun-Feng Song, Johannes A Soons, Richard M Silver
Abstract: NIST methods for calibration of surface roughness parameters and step height are described. The surface roughness parameters currently being measured include roughness average (Ra), root mean square (rms) roughness (Rq), average maximum height of the ...

9. Three-dimensional deep sub-wavelength defect detection using (lambda) = 193 nm optical microscopy
Published: 10/25/2013
Authors: Bryan M Barnes, Martin Y Sohn, Francois R. Goasmat, Hui Zhou, Andras Vladar, Richard M Silver, Abraham Arceo
Abstract: Identifying defects in photolithographic patterning is a persistent challenge in semiconductor manufacturing. Well-established optical methods in current use are jeopardized by upcoming sub-20 nm device dimensions. Volumetric processing of focus-reso ...

10. Quantitative microscope characterization for parametric measurements with sub-nm parametric uncertainties
Published: 9/23/2013
Authors: Bryan M Barnes, Jing Qin, Hui Zhou, Richard M Silver
Abstract: Recently, a new technique called Fourier normalization has enabled the parametric fitting of optical images with multiple or even a continuum of spatial frequencies. Integral to the performance of this methodology is the characterization of the high ...

Search NIST-wide:

(Search abstract and keywords)

Last Name:
First Name:

Special Publications:

Looking for a NIST Special Publication (NIST SP Series)? Place the series number and dash in the report number field (Example: 800-) and begin your search.

  • SP 250-XX: Calibration Services
  • SP 260-XX: Standard Reference Materials
  • SP 300-XX: Precision Measurement and Calibration
  • SP 400-XX: Semiconductor Measurement Technology
  • SP 480-XX: Law Enforcement Technology
  • SP 500-XX: Computer Systems Technology
  • SP 700-XX: Industrial Measurement Series
  • SP 800-XX: Computer Security Series
  • SP 823-XX: Integrated Services Digital Network Series