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You searched on: Author: Richard Silver

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1. Quantitative tool characterization of a 193 nm scatterfield microscope
Published: 9/9/2015
Authors: Martin Y Sohn, Bryan M Barnes, Hui Zhou, Richard M Silver
Abstract: Optical microscope tool characterization has been investigated for the quantitative measurements of deep sub-wavelength features using a Fourier plane normalization method. The NIST 193 nm scatterfield microscope operating with an ArF Excimer laser, ...

2. Use of Bayesian Statistics to Improve Optical Measurement Uncertainty by Combined Multi-Tool Metrology
Published: 6/25/2015
Authors: Nien F Zhang, Richard M Silver, Hui Zhou, Bryan M Barnes
Abstract: Recently, there has been significant research investigating new optical technologies for dimensional metrology of features 32 nm in critical dimension and smaller. When modeling optical measurements a library of curves is assembled through the simula ...

3. The effect of systematic errors on the hybridization of optical critical dimension measurements
Published: 6/21/2015
Authors: Mark Alexander Henn, Richard M Silver, Nien F Zhang, Hui Zhou, Bryan M Barnes
Abstract: In hybrid metrology two or more measurements of the same measurand are combined to provide a more reliable result that ideally incorporates the individual strengths of each of the measurement methods. While these multiple measurements may come from d ...

4. Scatterfield Microscopy and the Fundamental Limits of Optical Defect Metrology
Published: 4/14/2015
Authors: Richard M Silver, Bryan M Barnes, Martin Y Sohn, Hui Zhou
Abstract: Defect inspection remains a critical manufacturing challenge due to the competing requirements between throughput and very high resolution. Currently only optical methods provide an acceptable solution, although there are a number of process layers ...

5. Optimizing Hybrid Metrology: Rigorous Implementation of Bayesian and Combined Regression
Published: 3/19/2015
Authors: Mark Alexander Henn, Richard M Silver, Nien F Zhang, Hui Zhou, Bryan M Barnes, Bin Ming, Andras Vladar, John S Villarrubia
Abstract: Hybrid metrology, e.g. the combination of several measurement techniques to determine critical dimensions, is an important approach to meet the needs of semiconductor industry. A proper use of hybrid metrology may not only yield more reliable estimat ...

6. Effects of wafer noise on the detection of 20 nm defects using optical volumetric inspection
Published: 2/11/2015
Authors: Bryan M Barnes, Francois R. Goasmat, Martin Y Sohn, Hui Zhou, Andras Vladar, Richard M Silver
Abstract: Patterning imperfections in semiconductor device fabrication may either be noncritical [e.g., line edge roughness (LER)] or critical, such as defects that impact manufacturing yield. As the sizes of the pitches and linewidths decrease in lithography, ...

7. 193 nm scatterfield microscope illumination optics
Published: 12/17/2014
Authors: Martin Y Sohn, Richard M Silver
Abstract: A scatterfield microscope for deep sub-wavelength semiconductor metrology using 193 nm light has been designed. In addition to accommodating the fixed numerical aperture and size of its commercial catadioptric objective lens, the illumination optics ...

8. Pattern Transfer of Hydrogen Depassivation Lithography Patterns into Silicon with Atomically Traceable Placement and Size Control
Published: 7/17/2014
Authors: Josh Ballard, Stephen McDonnell, Don Dick, Maia Bischof, Joseph Fu, D Jaeger, James Owen , w Owen, Justin Alexander, Udi Fuchs, Pradeep N. (Pradeep) Namboodiri, Kai Li, John Randall, Robert Wallace, Yves Chabal, Richard Reidy, Richard M Silver
Abstract: Reducing the scale of etched nanostructures below the 10 nm range eventually will require an atomic scale understanding of the masks being used in order to maintain exquisite control over both feature size and feature density. Here, we demonstrate a ...

9. Optimizing Hybrid Metrology through a Consistent Multi-Tool Parameter Set and Uncertainty Model
Published: 4/14/2014
Authors: Richard M Silver, Bryan M Barnes, Nien F Zhang, Hui Zhou, Andras Vladar, John S Villarrubia, Regis J Kline, Daniel Franklin Sunday, Alok Vaid
Abstract: There has been significant interest in hybrid metrology as a novel method for reducing overall measurement uncertainty and optimizing measurement throughput (speed) through rigorous combinations of two or more different measurement techniques into a ...

10. Optical volumetric inspection of sub-20 nm patterned defects with wafer noise
Published: 4/2/2014
Authors: Bryan M Barnes, Francois R. Goasmat, Martin Y Sohn, Hui Zhou, Richard M Silver, Andras Vladar, Abraham Arceo
Abstract: We have previously introduced a new data analysis method that more thoroughly utilizes scattered optical intensity data collected during defect inspection using bright-field microscopy. This volumetric approach allows conversion of focus resolved 2-D ...

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