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Author: benjamin tsai

Displaying records 11 to 20 of 97 records.
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11. Modeling Radiative Properties of Silicon with Coatings and Comparison with Reflectance Measurements
Published: 1/1/2005
Authors: D P DeWitt, E A. Early, B J Lee, Benjamin K Tsai, Z M Zhang
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=104397

12. In Situ Calibration of Lightpipe Radiometers in Rapid Thermal Processing Between 300 C to 700 C
Published: 9/15/2004
Authors: William Andrew Kimes, Kenneth Gruber Kreider, Dean C Ripple, Benjamin K Tsai
Abstract: Many Rapid Thermal Processing (RTP) tools are currently monitored and controlled with lightpipe radiometers (LPRTs), which have been limited to measuring temperatures above 500 C because of the low signal level below 500 C. New commercial LPRTs co ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=830903

13. Emissivity Compensated Pyrometry for Specular Silicon Surfaces on the NIST RTP Test Bed
Published: 9/1/2004
Authors: Benjamin K Tsai, J Bodycomb, D P DeWitt, Kenneth Gruber Kreider, William Andrew Kimes
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=841857

14. Comparing the Transient Response of a Resistive-Type Sensor With a Thin Film Thermocouple During the Post-Exposure Bake Process
Published: 4/1/2004
Authors: Kenneth Gruber Kreider, D P DeWitt, J B Fowler, J E Proctor, William Andrew Kimes, Dean C Ripple, Benjamin K Tsai
Abstract: Recent studies on dynamic temperature profiling and lithographic performance modeling of the post-exposure bake (PEB) process have demonstrated that the rate of heating and cooling may have an important influence on resist lithographic response. Gen ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=830864

15. Comparing the Transient Response of a Resistive-Type Sensor with a Thin-Film Thermocouple During the Post-Exposure Bake Process, Data Analysis and Modeling for Process Control
Published: 1/1/2004
Authors: K G Kreider, D P DeWitt, J B Fowler, J E Proctor, W A. Kimes, D C Ripple, Benjamin K Tsai
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=104578

16. Emissivity Compensated Pyrometry for Specular Silicon Surfaces on the NIST RTP Test Bed
Published: 1/1/2004
Authors: Benjamin K Tsai, J Bodycomb, D P DeWitt, K G Kreider, W A. Kimes
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=104787

17. Emissivity Compensated Pyrometry for Specular Silicon Surfaces on the NIST RTP Test Bed
Published: 1/1/2004
Authors: J Bodycomb, D P DeWitt, W A. Kimes, K G Kreider, Benjamin K Tsai
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=104323

18. Heat-Flux Sensor Calibration
Series: Special Publication (NIST SP)
Published: 1/1/2004
Authors: Benjamin K Tsai, Charles E Gibson, M V Annageri, D P DeWitt, Robert D. Saunders
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=104786

19. In Situ Calibration of Lightpipe Radiometers for Rapid Thermal Processing between 300 {degree} C to 700 {degree} C
Published: 1/1/2004
Authors: W A. Kimes, K G Kreider, D C Ripple, Benjamin K Tsai
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=104572

20. Calibration of Radiation Thermometers in Rapid Thermal Processing Tools Using Si Wafers with Thin Film Thermocouples
Published: 10/1/2003
Authors: Kenneth Gruber Kreider, William Andrew Kimes, Christopher W Meyer, Dean C Ripple, Benjamin K Tsai, D H Chen, D P DeWitt
Abstract: Rapid thermal processing (RTP) tools are currently monitored and controlled with lightpipe radiation thermometers (LPRTs) which have been calibrated with thermocouple instrumented wafers. We have developed a thin-film thermocouple wafer that enables ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=830794



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