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Author: eric lin

Displaying records 191 to 198.
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191. Investigation of N^d2^ Plasma Effects on the Depth Profile of Hydrogen Silsesquioxane Thin Films Using High Resolution Specular X-Ray Reflectivity
Published: Date unknown
Authors: Hae-Jeong Lee, Eric K Lin, J K Lan, Y L Cheng, H C Liou, Wen-Li Wu, Y L Wang, M S Feng, C G Chao
Abstract: Non-destructive, specular X-ray reflectivity (SXR) measurements were used to investigate N2 plasma effects on the density depth profile of hydrogen silsesquioxane (HSQ) thin films. The SXR data indicate that the density profile of an HSQ film withou ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851763

192. Materials Characterization of Thin Films of Epoxide Functionalized Silsesquioxanes as Potential Underfill Encapsulants
Published: Date unknown
Authors: Eric K Lin, Wen-Li Wu, C X Zhang, R M Laine
Abstract: Current underfill materials generally consist of an epoxy resin filled withsilica particles and are designed to reduce stresses arising from the difference in the thermal expansion between the silicon die and the substrate. Currently, concerns about ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851538

193. Materials Science and Engineering Laboratory. FY 2004 Programs and Accomplishments: MSEL Materials for Micro- and Optoelectronics
Series: NIST Interagency/Internal Report (NISTIR)
Report Number: 7129
Published: Date unknown
Author: Eric K Lin
Abstract: This report documents the programs and accomplishments during fiscal year 2004
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852492

194. Measuring Structure and Order Development in Organic Semiconductor Films Using Soft X-Ray Spectroscopy
Published: Date unknown
Authors: Dean M DeLongchamp, S Sambasivan, Daniel A Fischer, Eric K Lin, Brandon M. Vogel
Abstract: Paper is abstract.
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852539

195. Neutron Reflectivity for Interfacial Materials Characterization
Published: Date unknown
Authors: Eric K Lin, D J Pochan, R Kolb, Wen-Li Wu, Sushil K. Satija
Abstract: Measurements of the physical properties of materials, such as the coefficient of thermal expansion (CTE), in thin films and at interfaces are very important in microelectronics packaging and interconnection, especially as electronic devices decrease ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851425

196. Structural Characterization of Deep Sub-Micron Lithographic Structures Using Angle Neutron Scattering
Published: Date unknown
Authors: Eric K Lin, Ronald Leland Jones, Wen-Li Wu, John G Barker, P J Bolton, G G Barclay
Abstract: As critical dimensions continue to decrease with each technology node, the precise characterization of line width and profile becomes an increasingly challenging task. Small angle neutron scattering (SANS) offers several advantages for the characteri ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=852013

197. Surface Directed Crystallization and Autophobic Dewetting in Semicrystalline Polymer Thin Films
Published: Date unknown
Authors: D J Pochan, Eric K Lin, Wen-Li Wu
Abstract: Significant crystallization is observed via atomic force microscopy and x-ray diffraction in spin-cast polymer thin films with thickness ranging from 5 microns to 80 nm. Neutron reflectivity also reveals significant crystallinity in the polymer dire ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851808

198. Understanding Deviations in Lithographic Patterns Near Interfaces: Characterization of Antireflective Coatings (ARC) and the ARC/Resist Interface
Published: Date unknown
Authors: Joseph~undefined~undefined~undefined~undefined~undefined Lenhart, Daniel A Fischer, S Sambasivan, Eric K Lin, Wen-Li Wu, Douglas Guerrero, Yijun Wang, R Puligadda
Abstract: Interactions between a bottom anti-reflective coating (BARC) and a photo-resist can critically impact lithographic patterns. For example, a lithographic pattern can shrink or spread near a BARC interface, a process called undercutting or footing res ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=850903



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