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You searched on: Author: robert keller

Displaying records 11 to 20 of 23 records.
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11. Evaluation of Thin Film Mechanical Properties by Means of Electrical Test Methods
Published: 9/30/2007
Authors: Nicholas Barbosa, Robert R Keller, David Thomas Read, Richard P. Vinci
Abstract: The ability to measure the mechanical properties of thin films and small scale structures is essential in designing reliable components at the micro- and nano-scales. It is known that the mechanical properties of thin film materials deviate from rela ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50339

12. An Electrical Method for Measuring Fatigue and Tensile Properties of Thin Films on Substrates
Published: 8/15/2007
Authors: Robert R Keller, Nicholas Barbosa, Roy H. Geiss, David Thomas Read
Abstract: A novel approach for measuring thermal fatigue lifetime and ultimate strength of patterned thin films on substrates is presented. The method is based on controlled application of cyclic joule heating by means of low-frequency, high-density alternatin ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50479

13. Report of the Workshop on Reliability Issues in Nanomaterials
Series: Special Publication (NIST SP)
Report Number: 1043
Published: 1/1/2007
Authors: Robert R Keller, David Thomas Read, Roop L Mahajan
Abstract: The Workshop on Reliability Issues in Nanomaterials was held at the Boulder Laboratories of the U. S. Department of Commerce on August 17-19, 2004. It was organized by the National Institute of Standards and Technology (NIST) and was designed to pro ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50180

14. Results of a Nanoindentation Round Robin on Thin Film Copper on Silicon
Published: 1/1/2007
Authors: David Thomas Read, Robert R Keller, Nicholas Barbosa, Roy H. Geiss
Abstract: Nanoindentation is used in a variety of fields to measure material hardness and elastic modulus. This test technique is especially attractive for thin films because of the difficulty of conducting tensile or other conventional mechanical characteriza ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50334

15. Strain-Induced Grain Growth during Rapid Thermal Cycling of Aluminum Interconnects
Published: 1/1/2007
Authors: Robert R Keller, Roy H. Geiss, Nicholas Barbosa, Andrew J Slifka, David Thomas Read
Abstract: We demonstrate by use of automated electron backscatter diffraction (EBSD) the rapid growth of grains in non-passivated, sputtered Al-1Si interconnects during 200 Hz thermal cycling induced by alternating electric current. Mean grain diameters were o ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50338

16. COMPARISON OF TEXTURE IN COPPER AND ALUMINUM THIN FILMS AS DETERMINED BY XRD AND EBSD
Published: 10/2/2006
Authors: Jens Mueller, Davor Balzar, Roy H. Geiss, David Thomas Read, Robert R Keller
Abstract: Texture in materials has a large influence on many properties of thin films; it is customarily determined by neutron or X-ray diffraction by measuring pole figures and evaluating orientation-distribution functions (ODF). X-ray diffraction (XRD) was t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50205

17. Electrical Methods for Mechanical Characterization of Interconnect Thin Films
Published: 9/1/2005
Authors: Robert R Keller, Cynthia A. Volkert, Roy H. Geiss, Andrew J Slifka, David Thomas Read, Nicholas Barbosa, Reiner Monig
Abstract: We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50210

18. Workshop on Reliability Issues in Nanomaterials
Series: Special Publication (NIST SP)
Report Number: 1043
Published: 8/1/2005
Authors: Robert R Keller, David Thomas Read, Roop L Mahajan
Abstract: The Workshop on Reliability Issues in Nanomaterials was held at the Boulder Laboratories of the National Institute of Standards and Technology (NIST) on August 17-19, 2004. It was designed to promote a particular subset of NIST?s responsibilities und ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50111

19. Microstructure Evolution during Electric Current Induced Thermomechanical Fatigue of Interconnects
Published: 4/1/2005
Authors: Robert R Keller, Roy H. Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: We demonstrate the evolution of microstructure and deformation associated with the use of electrical methods for evaluating mechanical reliability of patterned interconnects on rigid substrates. Thermomechanical fatigue in aluminum and copper interco ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50148

20. TEM Analysis of Deformation in Thin Films of Aluminum after both AC Thermomechanical and Tensile Deformation
Published: 4/1/2005
Authors: Roy H. Geiss, Robert R Keller, David Thomas Read, Yi-Wen Cheng
Abstract: Thin films of sputtered aluminum were deformed by two distinctly different experimental techniques. One experiment comprised of passing high electrical AC current density, 12.2 MA/cm2 at 100 Hz, through 800 ¿¿m long X 3.3 ¿¿m wide and 0.5 ¿¿m thick p ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50149



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