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Author: robert keller

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11. Report of the Workshop on Reliability Issues in Nanomaterials
Series: Special Publication (NIST SP)
Report Number: 1043
Published: 1/1/2007
Authors: Robert R Keller, David Thomas Read, Roop L Mahajan
Abstract: The Workshop on Reliability Issues in Nanomaterials was held at the Boulder Laboratories of the U. S. Department of Commerce on August 17-19, 2004. It was organized by the National Institute of Standards and Technology (NIST) and was designed to pro ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50180

12. Results of a Nanoindentation Round Robin on Thin Film Copper on Silicon
Published: 1/1/2007
Authors: David Thomas Read, Robert R Keller, Nicholas Barbosa, Roy Howard Geiss
Abstract: Nanoindentation is used in a variety of fields to measure material hardness and elastic modulus. This test technique is especially attractive for thin films because of the difficulty of conducting tensile or other conventional mechanical characteriza ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50334

13. Strain-Induced Grain Growth during Rapid Thermal Cycling of Aluminum Interconnects
Published: 1/1/2007
Authors: Robert R Keller, Roy Howard Geiss, Nicholas Barbosa, Andrew J Slifka, David Thomas Read
Abstract: We demonstrate by use of automated electron backscatter diffraction (EBSD) the rapid growth of grains in non-passivated, sputtered Al-1Si interconnects during 200 Hz thermal cycling induced by alternating electric current. Mean grain diameters were o ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50338

14. COMPARISON OF TEXTURE IN COPPER AND ALUMINUM THIN FILMS AS DETERMINED BY XRD AND EBSD
Published: 10/2/2006
Authors: Jens Mueller, Davor Balzar, Roy Howard Geiss, David Thomas Read, Robert R Keller
Abstract: Texture in materials has a large influence on many properties of thin films; it is customarily determined by neutron or X-ray diffraction by measuring pole figures and evaluating orientation-distribution functions (ODF). X-ray diffraction (XRD) was t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50205

15. Electrical Methods for Mechanical Characterization of Interconnect Thin Films
Published: 9/1/2005
Authors: Robert R Keller, Cynthia A. Volkert, Roy Howard Geiss, Andrew J Slifka, David Thomas Read, Nicholas Barbosa, Reiner Monig
Abstract: We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50210

16. Workshop on Reliability Issues in Nanomaterials
Series: Special Publication (NIST SP)
Report Number: 1043
Published: 8/1/2005
Authors: Robert R Keller, David Thomas Read, Roop L Mahajan
Abstract: The Workshop on Reliability Issues in Nanomaterials was held at the Boulder Laboratories of the National Institute of Standards and Technology (NIST) on August 17-19, 2004. It was designed to promote a particular subset of NIST?s responsibilities und ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50111

17. Microstructure Evolution during Electric Current Induced Thermomechanical Fatigue of Interconnects
Published: 4/1/2005
Authors: Robert R Keller, Roy Howard Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: We demonstrate the evolution of microstructure and deformation associated with the use of electrical methods for evaluating mechanical reliability of patterned interconnects on rigid substrates. Thermomechanical fatigue in aluminum and copper interco ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50148

18. TEM Analysis of Deformation in Thin Films of Aluminum after both AC Thermomechanical and Tensile Deformation
Published: 4/1/2005
Authors: Roy Howard Geiss, Robert R Keller, David Thomas Read, Yi-Wen Cheng
Abstract: Thin films of sputtered aluminum were deformed by two distinctly different experimental techniques. One experiment comprised of passing high electrical AC current density, 12.2 MA/cm2 at 100 Hz, through 800 ¿¿m long X 3.3 ¿¿m wide and 0.5 ¿¿m thick p ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50149

19. Electric Current Induced Thermomechanical Fatigue Testing of Interconnects
Published: 3/1/2005
Authors: Robert R Keller, Roy Howard Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: We demonstrate the use of electrical methods for evaluating the thermomechanical fatigue properties of patterned aluminum and copper interconnects on silicon-based substrates. Through a careful selection of alternating current frequency and current d ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50110

20. Microstructure Evolution during Alternating-Current-lnduced Fatigue
Published: 11/1/2004
Authors: Robert R Keller, Roy Howard Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: Subjecting electronic interconnect lines to high-density, low.frequency alternating current creates cyclic thermomechanical stresses that eventually cause electrical failure. A detailed understanding of the failure process could contribute to both pr ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50088



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