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Author: roy geiss
Displaying records 31 to 34.
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31.
Influence of Tip Wear on Atomic Force Acoustic Microscopy Experiments
Published: 1/31/2005
Authors: Malgorzata Kopycinska-Mueller, Roy Howard Geiss, Paul Rice, Donna C Hurley
Abstract: Tip wear and its corresponding change in geometry is a major impediment for quantifying atomic force acoustic microscopy (AFAM). To better understand the process of tip wear and its influence on AFAM measurements of material elastic properties, we ha
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=30031
32.
Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures
Published: 11/19/2004
Authors: David Thomas Read, Yi-Wen Cheng, Roy Howard Geiss
Abstract: The temperature dependence of the strength of a thin copper electrodeposit has been measured from room temperature to 150 {degree}C by microtensile testing. The ultimate tensile strength decreased from around 240 MPa at room temperature to just above
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50059
33.
Microstructure Evolution during Alternating-Current-lnduced Fatigue
Published: 11/1/2004
Authors: Robert R Keller, Roy Howard Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: Subjecting electronic interconnect lines to high-density, low.frequency alternating current creates cyclic thermomechanical stresses that eventually cause electrical failure. A detailed understanding of the failure process could contribute to both pr
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50088
34.
Electron Backscatter Diffraction for Studies of Localized Deformation
Published: Date unknown
Authors: Roy Howard Geiss, Alexana Roshko, Kristine A Bertness, R R Keller
Abstract: Electron backscatter diffraction (EBSD) was used to study localized deformation in two types ofconstrained-volume materials. We present a study of deformation in narrow aluminum interconnects afterlow frequency, AC cycling at high current density.
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http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851325