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31. Microstructure Evolution during Electric Current Induced Thermomechanical Fatigue of Interconnects
Published: 4/1/2005
Authors: Robert R Keller, Roy Howard Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: We demonstrate the evolution of microstructure and deformation associated with the use of electrical methods for evaluating mechanical reliability of patterned interconnects on rigid substrates. Thermomechanical fatigue in aluminum and copper interco ...

32. TEM Analysis of Deformation in Thin Films of Aluminum after both AC Thermomechanical and Tensile Deformation
Published: 4/1/2005
Authors: Roy Howard Geiss, Robert R Keller, David Thomas Read, Yi-Wen Cheng
Abstract: Thin films of sputtered aluminum were deformed by two distinctly different experimental techniques. One experiment comprised of passing high electrical AC current density, 12.2 MA/cm2 at 100 Hz, through 800 ¿¿m long X 3.3 ¿¿m wide and 0.5 ¿¿m thick p ...

33. Electric Current Induced Thermomechanical Fatigue Testing of Interconnects
Published: 3/1/2005
Authors: Robert R Keller, Roy Howard Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: We demonstrate the use of electrical methods for evaluating the thermomechanical fatigue properties of patterned aluminum and copper interconnects on silicon-based substrates. Through a careful selection of alternating current frequency and current d ...

34. Influence of Tip Wear on Atomic Force Acoustic Microscopy Experiments
Published: 1/31/2005
Authors: Malgorzata Kopycinska-Mueller, Roy Howard Geiss, Paul Rice, Donna C. Hurley
Abstract: Tip wear and its corresponding change in geometry is a major impediment for quantifying atomic force acoustic microscopy (AFAM). To better understand the process of tip wear and its influence on AFAM measurements of material elastic properties, we ha ...

35. Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures
Published: 11/19/2004
Authors: David Thomas Read, Yi-Wen Cheng, Roy Howard Geiss
Abstract: The temperature dependence of the strength of a thin copper electrodeposit has been measured from room temperature to 150 {degree}C by microtensile testing. The ultimate tensile strength decreased from around 240 MPa at room temperature to just above ...

36. Microstructure Evolution during Alternating-Current-lnduced Fatigue
Published: 11/1/2004
Authors: Robert R Keller, Roy Howard Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: Subjecting electronic interconnect lines to high-density, low.frequency alternating current creates cyclic thermomechanical stresses that eventually cause electrical failure. A detailed understanding of the failure process could contribute to both pr ...

37. Electron Backscatter Diffraction for Studies of Localized Deformation
Published: Date unknown
Authors: Roy Howard Geiss, Alexana Roshko, Kristine A Bertness, R R Keller
Abstract: Electron backscatter diffraction (EBSD) was used to study localized deformation in two types ofconstrained-volume materials. We present a study of deformation in narrow aluminum interconnects afterlow frequency, AC cycling at high current density. ...

38. Terbium-Doped Magnetite Nanocrystals for Multimodal Imaging Agents
Published: Date unknown
Authors: Katherine P. Rice, Stephen E Russek, Roy Howard Geiss, Justin M Shaw, Robert J. Usselman, Eric R Evarts, Thomas J Silva, Hans Toya Nembach, Elke Arenholz, Yves Idzerda
Abstract: High quality cubic Tb-doped magnetite nanocrystals have been fabricated and have shown that the Tb is incorporated into the octahedral 3+ sites. Magnetization and FMR data indicate that the Tb spins are weakly coupled to the iron spin lattice at ...

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