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Displaying records 31 to 40 of 45 records.
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31. Nanoscale elastic-property measurements and mapping using atomic force acoustic microscopy methods
Published: 9/23/2005
Authors: Donna C. Hurley, Malgorzata Kopycinska-Mueller, Tony B. Kos, Roy H. Geiss
Abstract: We describe a dynamic atomic force microscopy (AFM) method to measure the nanoscale elastic properties of surfaces, thin films, and nanostructures. Our approach is based on atomic force acoustic microscopy (AFAM) techniques and involves the resonant ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50024

32. Multilayer and functional coatings on carbon nanotubes using atomic layer deposition
Published: 9/14/2005
Authors: Cari F. Herrmann, F Fabreguette, Dudley Finch, Roy H. Geiss, S M George
Abstract: Atomic layer deposition can be used to deposit ultra thin and conformal films on substrates with very high aspect ratios such as nanotubes and nanowires. In this paper, we demonstrate that functionalized and multilayered ALD coatings can be deposited ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=30022

33. Electrical Methods for Mechanical Characterization of Interconnect Thin Films
Published: 9/1/2005
Authors: Robert R Keller, Cynthia A. Volkert, Roy H. Geiss, Andrew J Slifka, David Thomas Read, Nicholas Barbosa, Reiner Monig
Abstract: We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in t ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50210

34. Contact mechanics and tip shape in afm-based nanomechanical measurements
Published: 8/31/2005
Authors: Malgorzata Kopycinska-Mueller, Roy H. Geiss, Donna C. Hurley
Abstract: Stiffness-load curves obtained in quantitative atomic force acoustic microscopy (AFAM) measurements depend on both the elastic properties of the sample and the geometry of the atomic force microscope (AFM) tip. The geometry of silicon AFM tips change ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50203

35. Quantitative Elastic-Property Measurements at the Nanoscale with Atomic Force Acoustic Microscopy
Published: 8/31/2005
Authors: Donna C. Hurley, Malgorzata Kopycinska-Mueller, Tony B. Kos, Roy H. Geiss
Abstract: We are developing metrology for rapid, quantitative assessment of elastic porperties with nanoscale spatial resolution. Atomic force acoustic microscopy (AFAM) methods enable modulus measurements at either a single point or as a map of local property ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50097

36. Acoustical methods to determine thin-film and nanoscale mechanical properties
Published: 5/31/2005
Authors: Donna C. Hurley, Roy H. Geiss, N Jennett, Malgorzata Kopycinska-Mueller, A Maxwell, Jens Mueller, David Thomas Read, J Wright
Abstract: We describe two acoustical methods to evaluate the mechanical properties of thin films and nanoscale structures: atomic force acoustic microscopy and surface acoustic wave spectroscopy. The elastic properties of an 800-nm-thick nickel film were exami ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50075

37. Elastic-property measurements of ultrathin films using atomic force acoustic microscopy
Published: 4/5/2005
Authors: Malgorzata Kopycinska-Mueller, Roy H. Geiss, Jens Mueller, Donna C. Hurley
Abstract: Atomic force acoustic microscopy (AFAM), an emerging technique that affords nanoscale lateral and depth resolution, was employed to measure the elastic properties of ultrathin films. In this study we measured the indentation modulus M of three nickel ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50093

38. Microstructure Evolution during Electric Current Induced Thermomechanical Fatigue of Interconnects
Published: 4/1/2005
Authors: Robert R Keller, Roy H. Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: We demonstrate the evolution of microstructure and deformation associated with the use of electrical methods for evaluating mechanical reliability of patterned interconnects on rigid substrates. Thermomechanical fatigue in aluminum and copper interco ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50148

39. TEM Analysis of Deformation in Thin Films of Aluminum after both AC Thermomechanical and Tensile Deformation
Published: 4/1/2005
Authors: Roy H. Geiss, Robert R Keller, David Thomas Read, Yi-Wen Cheng
Abstract: Thin films of sputtered aluminum were deformed by two distinctly different experimental techniques. One experiment comprised of passing high electrical AC current density, 12.2 MA/cm2 at 100 Hz, through 800 ¿¿m long X 3.3 ¿¿m wide and 0.5 ¿¿m thick p ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50149

40. Electric Current Induced Thermomechanical Fatigue Testing of Interconnects
Published: 3/1/2005
Authors: Robert R Keller, Roy H. Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: We demonstrate the use of electrical methods for evaluating the thermomechanical fatigue properties of patterned aluminum and copper interconnects on silicon-based substrates. Through a careful selection of alternating current frequency and current d ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50110



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