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Author: roy geiss

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31. Influence of Tip Wear on Atomic Force Acoustic Microscopy Experiments
Published: 1/31/2005
Authors: Malgorzata Kopycinska-Mueller, Roy Howard Geiss, Paul Rice, Donna C Hurley
Abstract: Tip wear and its corresponding change in geometry is a major impediment for quantifying atomic force acoustic microscopy (AFAM). To better understand the process of tip wear and its influence on AFAM measurements of material elastic properties, we ha ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=30031

32. Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures
Published: 11/19/2004
Authors: David Thomas Read, Yi-Wen Cheng, Roy Howard Geiss
Abstract: The temperature dependence of the strength of a thin copper electrodeposit has been measured from room temperature to 150 {degree}C by microtensile testing. The ultimate tensile strength decreased from around 240 MPa at room temperature to just above ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50059

33. Microstructure Evolution during Alternating-Current-lnduced Fatigue
Published: 11/1/2004
Authors: Robert R Keller, Roy Howard Geiss, Yi-Wen Cheng, David Thomas Read
Abstract: Subjecting electronic interconnect lines to high-density, low.frequency alternating current creates cyclic thermomechanical stresses that eventually cause electrical failure. A detailed understanding of the failure process could contribute to both pr ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=50088

34. Electron Backscatter Diffraction for Studies of Localized Deformation
Published: Date unknown
Authors: Roy Howard Geiss, Alexana Roshko, Kristine A Bertness, R R Keller
Abstract: Electron backscatter diffraction (EBSD) was used to study localized deformation in two types ofconstrained-volume materials. We present a study of deformation in narrow aluminum interconnects afterlow frequency, AC cycling at high current density. ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=851325



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