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Author: richard allen
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1. Metrology Needs for TSV Fabrication
Published: 3/4/2014
Authors: Victor Vartanian, Richard A Allen, Larry Smith, Klaus Hummler, Steve Olson, Brian Sapp
Abstract: This paper focuses on the metrology needs and challenges of through silicon via (TSV) fabrication, consisting of TSV etch, liner, barrier, and seed (L/B/S) depositions, copper plating, and copper CMP. These TSVs, with typical dimensions within a f ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914497

2. Detection of 3D Interconnect Bonding Voids by IR Microscopy
Published: 2/20/2014
Authors: Jonny H?glund, Zoltan Kiss, Gyorgy Nadudvari , Zsolt Kovacs, Szabolcs Velkei, Moore Chris, Victor Vartanian, Richard A Allen
Abstract: There are a number of factors driving 3D integration including reduced power consumption, RC delay, and form factor as well as increased bandwidth. However, before these advantages can be realized, various technical and cost hurdles must be overcom ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=914474

3. TSV Reveal height and bump dimension metrology by the TSOM method
Published: 4/30/2013
Authors: Ravikiran Attota, Haesung Park, Victor Vartanian, Ndubuisi George Orji, Richard A Allen
Abstract: Through-focus scanning optical microscopy (TSOM) transforms conventional optical microscopes into truly 3D metrology tools for nanoscale- to- microscale dimensional analysis with nanometer-scale sensitivity. Although not a resolution enhancement meth ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=913667

4. The MEMS 5-in-1 Test Chips (Reference Materials 8096 and 8097)
Published: 3/27/2013
Authors: Janet M Cassard, Jon C Geist, Craig Dyer McGray, Richard A Allen, Muhammad Yaqub Afridi, Brian Joseph Nablo, Michael Gaitan, David G Seiler
Abstract: This paper presents an overview of the Microelectromechanical Systems (MEMS) 5-in-1 Reference Material (RM), which is a single test chip with test structures from which material and dimensional properties are obtained using five documentary standard ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=912229

5. EVALUATING METHODS OF SHIPPING THIN SILICON WAFERS FOR 3D STACKED APPLICATIONS
Published: 11/7/2012
Authors: Richard A Allen, Urmi Ray, Vidhya Ramachandran, Iqbal Ali, David Thomas Read, Andreas Fehk¿hrer, J¿rgen Burggraf
Abstract: An experiment was performed to develop a method for choosing appropriate packaging for shipping 300 mm silicon wafers thinned to 100 µm or less for three-dimensional stacked integrated circuits (3DS-ICs). 3DS-ICs hold the promise of improved pe ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=912462

6. Robust Auto-Alignment Technique for Orientation-Dependent Etching of Nanostructures
Published: 5/29/2012
Authors: Craig Dyer McGray, Richard J Kasica, Ndubuisi George Orji, Ronald G Dixson, Michael W Cresswell, Richard A Allen, Jon C Geist
Abstract: A robust technique is presented for auto-aligning nanostructures to slow-etching crystallographic planes in materials with diamond cubic structure. Lithographic mask patterns are modified from the intended dimensions of the nanostructures to compen ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908076

7. Rectangular Scale-Similar Etch Pits in Monocrystalline Diamond
Published: 9/15/2011
Authors: Craig Dyer McGray, Richard A Allen, Marc J Cangemi, Jon C Geist
Abstract: Etching of monocrystalline diamond in oxygen and water vapor at 1100° C through small pores in a silicon nitride film produced smooth-walled rectangular cavities. The cavities were imaged by electron microscope and measured by interferometric microsc ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908075

8. Test Structure Fundamentals
Published: 4/4/2011
Author: Richard A Allen
Abstract: Test structures are critical tools for semiconductor manufacturers, allowing for understanding of the process and individual circuit elements that cannot be acquired from measurements of the circuits, which can have billions of transistors and othe ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908448

9. Intercomparison of Methods for Detecting and Characterizing Voids in Bonded Wafer Pairs
Published: 10/14/2010
Author: Richard A Allen
Abstract: The Wafer Bond Task Force of the SEMI MEMS Standards Committee has begun a round robin experiment to evaluate methods for identifying and characterizing voids in bonded wafer pairs for three-dimensional integrated circuit (3D IC) applications. Due ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=908447

10. Intercomparison of Methods for Detecting and Characterizing Voids in Bonded Wafer Pairs
Published: 10/1/2010
Authors: Richard A Allen, Andrew C. Rudack, David Thomas Read, Winthrop A. Baylies
Abstract: The Wafer Bond Task Force of the SEMI MEMS Standards Committee has begun a round robin experiment to evaluate methods for identifying and characterizing voids in bonded wafer pairs for three-dimensional integrated circuit (3D IC) applications. Due ...
http://www.nist.gov/manuscript-publication-search.cfm?pub_id=906152



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