The Back-End-of-Line (BEOL) Reliability Metrology Development project aims to develop the metrology to enable quantitative and mechanistic assessment of performance limiting reliability issues in emerging electronic devices related to new materials, processes, and integration schemes.
The Back-End-of-Line Reliability Metrology Development project supports the PML priorities in Measurements for Advanced Manufacturing in the areas of Nonmanufacturing, Novel devices, and Electronic materials. Specifically, the project aims to develop the metrology to enable the quantitative and mechanistic assessment of performance limiting reliability issues in emerging electronic devices related to new materials, processes, and integration schemes. Examples include metrology and documentary standards to enable 3D integration of integrated circuits.
The ultimate aim of the project is to develop the metrology to enable fundamental Physics of Failure (PoF) approach to reliability assessments in support of designed-in reliability in nano-manufacturing of advanced electronics. Our work uses direct experimental measurements, inferred root causes of failure such as thermo-mechanical stress, fatigue, fracture, wear, and corrosion to inform modeling, and simulation to address various failure mechanisms in electronic devices. In this work, it helps to understand the impact of material choices and integration on system performance.
The project leverages competencies in scanning probe based metrology, electromagnetics (broadband RF-measurements), and semiconductor process integration knowledge. We work collaboratively with national and international partners, such as SEMATECH and CEA-Leti.
Lead Organizational Unit:pml
Yaw Obeng (Project Leader)
100 Bureau Drive, M/S 8120