Surface and Nanostructure Metrology Group

The Surface and Nanostructure Metrology Group in the Semiconductor & Dimensional Metrology Division of the Physical Measurement Laboratory (PML) at the National Institute of Standards and Technology (NIST), establishes best-in-the-world SI-traceable length metrology for 3D nanostructures using high-throughput, non-destructive measurement methods with rigorous nanoscale reference metrology. We work closely with leading US semiconductor manufacturers, metrology tool manufacturers and consortia to provide new measurement solutions for critical defect and dimensional metrology needs. We develop the fundamental measurement science and data analysis methods in support of government and US manufacturing where surface roughness, form, and nano-structure topography are critical.

Activities include:

• modeling for deep sub-wavelength optical metrology and scanned probe dynamics
• applying advanced optical measurement methods and algorithms to create the forensic science underpinnings for ballistics and forensic topography
• realizing new atomic scale metrology methods to support the advanced needs of U.S. microelectronic- and nano-manufacturing industries.

Technical Areas

	Surface Finish Metrology—The Surface and Microform Metrology Group carries out research projects for the measurement and calibration of surface roughness. Surface roughness measurements and specifications impact many industrial products including highways, …
	Microform Metrology—What is microform? With developments in computer science and technology, microelectronics, precision engineering, and micromechanics, many engineering parts with small sizes and tight tolerances must be measured with high accuracy …
	Calibrated Atomic Force Microscopy—Why are atomic force microscope (AFM) standards needed? Atomic force microscopes (AFM’s) are being increasingly used as metrology tools in a variety of industrial applications, thus driving an increasing demand …
	Metrology Electron Microscopy—A scanning electron microscope (SEM) with ultra-high vacuum (UHV) environment has a cold field emitter as its beam source. Less than 10 nm beam resolution can be achieved …
	Electromagnetic Scattering—How is electromagnetic scattering used in metrology? The products of the semiconductor industry contain features such as lines and trenches that are gradually being reduced in size, so that now their dimensions are often comparable to …
	Standard Bullets and Casings—As with fingerprints, every firearm has unique characteristics and, when fired, imprints unique signatures on the bullets and casings. By analyzing these ballistics signatures, examiners are able to connect a particular firearm …