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|Author(s):||K. R. Phillips; Dylan F. Williams;|
|Title:||MMIC Package Characterization with Active Loads|
|Published:||November 01, 1990|
|Abstract:||Abstract: A technique for characterizing microwave packages based on active PIN diode standards is discussed. The technique allows packages to be accurately characterized from external reflection coefficient measurements when a single bias-dependent active standard is embedded within it. The frequency characteristics, stability, and linearity of active PIN diode standards are investigated.|
|Proceedings:||Tech Dig., Auto. RF Tech. Group Conf.|
|Pages:||pp. 64 - 72|
|Dates:||November 29-30, 1990|
|DOI:||http://dx.doi.org/10.1109/ARFTG.1990.323997 (Note: May link to a non-U.S. Government webpage)|
|PDF version:||Click here to retrieve PDF version of paper (632KB)|