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PUBLICATIONS

MMIC Package Characterization with Active Loads

Published

Author(s)

K. R. Phillips, Dylan Williams

Abstract

Abstract: A technique for characterizing microwave packages based on active PIN diode standards is discussed. The technique allows packages to be accurately characterized from external reflection coefficient measurements when a single bias-dependent active standard is embedded within it. The frequency characteristics, stability, and linearity of active PIN diode standards are investigated.
Proceedings Title
Tech Dig., Auto. RF Tech. Group Conf.
Volume
18
Conference Dates
November 29-30, 1990
Conference Location
Monterey, CA
Pub Type
Conferences

Download Paper

https://doi.org/10.1109/ARFTG.1990.323997
Local Download
Electromagnetics

Citation

Phillips, K. and Williams, D. (1990), MMIC Package Characterization with Active Loads, Tech Dig., Auto. RF Tech. Group Conf., Monterey, CA, [online], https://doi.org/10.1109/ARFTG.1990.323997, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=9318 (Accessed October 13, 2025)

Issues

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Created October 31, 1990, Updated October 12, 2021
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