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Publication Citation: MMIC Package Characterization with Active Loads

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Author(s): K. R. Phillips; Dylan F. Williams;
Title: MMIC Package Characterization with Active Loads
Published: November 01, 1990
Abstract: Abstract: A technique for characterizing microwave packages based on active PIN diode standards is discussed. The technique allows packages to be accurately characterized from external reflection coefficient measurements when a single bias-dependent active standard is embedded within it. The frequency characteristics, stability, and linearity of active PIN diode standards are investigated.
Proceedings: Tech Dig., Auto. RF Tech. Group Conf.
Volume: 18
Pages: pp. 64 - 72
Location: Monterey, CA
Dates: November 29-30, 1990
Research Areas: Electromagnetics
DOI: http://dx.doi.org/10.1109/ARFTG.1990.323997  (Note: May link to a non-U.S. Government webpage)
PDF version: PDF Document Click here to retrieve PDF version of paper (632KB)