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Publication Citation: User's Guide for RM 8096 and 8097: The MEMS 5-in-1, 2013 Edition

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Author(s): Janet M. Cassard; Jon C. Geist; Theodore V. Vorburger; David T. Read; Michael Gaitan; David G. Seiler;
Title: User's Guide for RM 8096 and 8097: The MEMS 5-in-1, 2013 Edition
Published: February 15, 2013
Abstract: The Microelectromechanical Systems (MEMS) 5-in-1 is a reference device sold as a NIST Reference Material (RM) that contains MEMS test structures on a test chip. The two RM chips (8096 and 8097) provide for both dimensional and material property measurements. RM 8096 was fabricated on a multi- user 1.5 um complementary metal oxide semiconductor (CMOS) process followed by a bulk-micromachining etch. Material properties of the composite oxide layer are reported on the RM Certificates and described within this guide. RM 8097 was fabricated using a polysilicon multi-user surface- micromachining MEMS process with a backside etch. The material properties of the first or second polysilicon layer are reported on the RM Certificates and described within this guide. The MEMS 5-in-1 contains MEMS test structures for use with five standard test methods on one test chip (from which its name is derived). The five standard test methods are for Young‰s modulus, step height, residual strain, strain gradient, and in-plane length measurements. The first two of these five standard test methods have been published through the Semiconductor Equipment and Materials International (SEMI) in February 2012. The remaining three standard test methods have been published through the American Society for Testing and Materials (ASTM) International in December 2011 or January 2012. All five of these standard test methods include round robin precision and bias data. The Certificates accompanying these RMs typically report eight properties. In addition to the five properties mentioned in the previous paragraph, residual stress, stress gradient, and thickness are also reported. The values for the first two of these properties are obtained from equations provided in the Young‰s modulus standard test method. The value for the third property (thickness) is obtained from step height measurements using the step height standard test method. Therefore, to determine the eight properties reported
Citation: NIST SP - 260-177
Pages: 253 pp.
Keywords: ASTM, cantilevers, fixed-fixed beams, interferometry, length measurements, MEMS, residual strain, residual stress, round robin, SEMI, RM, step height measurements, strain gradient, stress gradient, test structures, thickness, vibrometry, Young‰s modulus measurements
Research Areas: SRM (Physical Properties)
DOI: http://dx.doi.org/10.6028/NIST.SP.260-177
PDF version: PDF Document Click here to retrieve PDF version of paper (8MB)