Three-dimensional Nanometrology with TSOM Optical Method

Published

December 10, 2011

Author(s)

Ravikiran Attota

Abstract

Through-focus scanning optical microscopy (TSOM) is a new metrology method that achieves 3D nanoscale measurement sensitivity using conventional optical microscopes; measurement sensitivities are comparable to what is typical when using scatterometry, scanning electron microscopy (SEM), and atomic force microscopy (AFM). TSOM can be used in both reflection and transmission modes and is applicable to a variety of target materials and shapes. Nanometrology applications that have been demonstrated by experiments or simulations include defect analysis, inspection and process control; critical dimension, photomask, overlay, nanoparticle, thin film, and 3D interconnect metrologies; line-edge roughness measurements; and nanoscale movements of parts in MEMS/NEMS. Industries that could benefit include semiconductor, data storage, photonics, biotechnology, and nanomanufacturing. TSOM is relatively simple and inexpensive, has a high throughput, and provides nanoscale sensitivity for 3D measurements with potentially significant savings and yield improvements in manufacturing.

Conference Dates

December 10-11, 2011

Conference Location

Pune

Conference Title

An International Conference on PRECISION, MESO, MICRO, AND NANO ENGINEERING

Pub Type

Conferences

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Keywords

three-dimensional metrology, TSOM, nanometrology, through-focus, optical microscope

Citation

Attota, R. (2011), Three-dimensional Nanometrology with TSOM Optical Method, An International Conference on PRECISION, MESO, MICRO, AND NANO ENGINEERING, Pune, -1, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=910045 (Accessed October 14, 2025)