Take a sneak peek at the new NIST.gov and let us know what you think!
(Please note: some content may not be complete on the beta site.).
NIST Authors in Bold
|Author(s):||Janet M. Cassard; Jon C. Geist; Theodore V. Vorburger; David T. Read; David G. Seiler;|
|Title:||User's Guide for SRM 2494 and 2495: The MEMS 5-in-1, 2011 Edition|
|Published:||September 06, 2011|
|Abstract:||The Microelectromechanical Systems (MEMS) 5-in-1 is a standard reference device sold as a NIST Standard Reference Material (SRM) that contains MEMS test structures on a test chip. The two SRM chips (2494 and 2495) provide for both dimensional and material property measurements. SRM 2494 was fabricated on a 1.5 υm complementary metal oxide semiconductor (CMOS) process via MOSIS. Material properties of the composite oxide layer are reported on the SRM Certificates and described within this guide. SRM 2495 was fabricated using a polysilicon multi-user MEMS process with a backside etch. The material properties of the first polysilicon layer are reported on the SRM Certificates and described within this guide. The MEMS 5-in-1 contains MEMS test structures for use with five standard test methods on one test chip (from which its name is derived). The five standard test methods are for Young's modulus, step height, residual strain, strain gradient, and in-plane length measurements. The first two of these five standard test methods have been published through the Semiconductor Equipment and Materials International (SEMI) in November 2009. The remaining three standard test methods have been published through the American Society for Testing and Materials (ASTM) in December 2005. All five of these standard test methods include round robin precision and bias data. The Certificates accompanying these SRMs report eight properties. In addition to the five properties mentioned in the previous paragraph, residual stress, stress gradient, and thickness are also reported. The values for the first two of these properties are obtained from equations provided in the Young's modulus standard test method. The value for the third property (thickness) is obtained from step height measurements using the step height standard test method. Therefore, to determine the eight properties reported here, five standard test methods are used.|
|Citation:||Special Publication (NIST SP) - 260-179|
|Keywords:||ASTM, cantilevers, fixed-fixed beams, interferometry, length measurements, MEMS, residual strain, residual stress, round robin, SEMI, SRM, step height measurements, strain gradient, stress gradient, test structures, thickness, vibrometry, Young‰s modulus measurements|
|Research Areas:||Standard Reference Materials|
|PDF version:||Click here to retrieve PDF version of paper (8MB)|