| Author(s): |
Jason T. Ryan; Lan Wei; Jason P. Campbell; Richard G. Southwick; Kin P. Cheung; Anthony Oates; John S. Suehle; Phillip Wong; |
| Title: |
Circuit-Aware Device Reliability Criteria Methodology |
| Published: |
September 12, 2011 |
| Abstract: |
Meeting reliability requirements is an increasingly more difficult challenge with each generation of CMOS technology. The disconnection between conventional one-size-fits-all reliability specifications and the wide range of circuit applications might be a huge waste of resources. By taking into consideration circuit-level figures of merit, a novel methodology to establish device reliability criteria that reflects real-world operation of devices in circuits is proposed and demonstrated. This ―circuit-aware‖ methodology makes a real step toward realizing the goal of application-aware reliability standards which do not require additional measurements. The beauty is its simplicity – a simple transformation to solve an important problem. The simplicity makes it attractive as a standard methodology. |
| Conference: |
European Solid State Device Research Conference |
| Proceedings: |
Proceedings of the European Solid State Device Research Conference |
| Pages: |
pp. 255 - 258 |
| Location: |
Helsinki, -1 |
| Dates: |
September 12-16, 2011 |
| Keywords: |
Reliability, Circuit Aware, Hot Carrier, Lifetime |
| Research Areas: |
Analysis Tools and Techniques, Characterization |
