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Publication Citation: Flip Chip Lamination to electrically contact organic single crystals on flexible substrates

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Author(s): Oana Jurchescu; Brad Conrad; Christina A. Hacker; David J. Gundlach; Curt A. Richter;
Title: Flip Chip Lamination to electrically contact organic single crystals on flexible substrates
Published: April 20, 2011
Abstract: The fabrication of top metal contacts for organic electronics represents a challenge and has important consequences for electrical properties of such systems. We report a low cost and non-destructive printing process, Flip Chip Lamination (FCL), to fabricate top contacts on rubrene single crystals on flexible plastic substrates. Surface chemistry treatments using fluorinated self-assembled monolayers combined with moderate heat and pressure allow conformal lamination of gold contacts onto rubrene single crystals. I-V characteristics of rubrene with FCL top contact and bottom bonded contacts suggests better quality at the interface compared to the analogue architecture of e-beam evaporated top contacts.
Citation: Applied Physics Letters
Volume: 98
Pages: 3 pp.
Keywords: organic electronics; flip-chip lamination; electronic contacts; organic-inorganic interface;
Research Areas: Nanofabrication, Nanomanufacturing, and Nanoprocessing, Nanoimprint lithography, Advanced Materials, Microelectronics, Molecular Electronics
PDF version: PDF Document Click here to retrieve PDF version of paper (712KB)