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|Author(s):||Oana Jurchescu; Brad Conrad; Christina A. Hacker; David J. Gundlach; Curt A. Richter;|
|Title:||Flip Chip Lamination to electrically contact organic single crystals on flexible substrates|
|Published:||April 20, 2011|
|Abstract:||The fabrication of top metal contacts for organic electronics represents a challenge and has important consequences for electrical properties of such systems. We report a low cost and non-destructive printing process, Flip Chip Lamination (FCL), to fabricate top contacts on rubrene single crystals on flexible plastic substrates. Surface chemistry treatments using fluorinated self-assembled monolayers combined with moderate heat and pressure allow conformal lamination of gold contacts onto rubrene single crystals. I-V characteristics of rubrene with FCL top contact and bottom bonded contacts suggests better quality at the interface compared to the analogue architecture of e-beam evaporated top contacts.|
|Citation:||Applied Physics Letters|
|Keywords:||organic electronics, flip-chip lamination, electronic contacts, organic-inorganic interface|
|Research Areas:||Nanofabrication, Nanomanufacturing, and Nanoprocessing, Nanoimprint lithography, Advanced Materials, Microelectronics, Molecular Electronics|
|PDF version:||Click here to retrieve PDF version of paper (712KB)|