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Publication Citation: Flip Chip Lamination Approach to Fabricate Top Metal Contacts on Organic-based Devices

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Author(s): Mariona Coll Bau; Oana Jurchescu; Nadine E. Gergel-Hackett; Curt A. Richter; Christina A. Hacker;
Title: Flip Chip Lamination Approach to Fabricate Top Metal Contacts on Organic-based Devices
Published: March 15, 2010
Abstract: Flip Chip Lamination approach to fabricate top metal contacts on organic-based devices ; M.Coll, O.D. Jurchescu, N. Gergel-Hackett, C.A. Richter, C,A, Hacker, American Physical Society (APS), March 2010, Portland, OR, USA (oral)
Pages: 30 pp.
Research Areas: Semiconductors, Nanoelectronics and Nanoscale Electronics, Nanofabrication, Nanomanufacturing, and Nanoprocessing, Nanoimprint lithography, Chemistry, Nanotechnology, Characterization, Nanometrology, and Nanoscale Measurements