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Publication Citation: Flip Chip Lamination Approach to Fabricate Ultrasmooth Metal Contacts for Organic-based Electronic Device

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Author(s): Mariona Coll Bau; Nadine E. Gergel-Hackett; Oana Jurchescu; Curt A. Richter; Christina A. Hacker;
Title: Flip Chip Lamination Approach to Fabricate Ultrasmooth Metal Contacts for Organic-based Electronic Device
Published: June 04, 2010
Abstract:
Pages: 30 pp.
Research Areas: Nanoelectronics and Nanoscale Electronics, Nanofabrication, Nanomanufacturing, and Nanoprocessing, Nanoimprint lithography, Chemistry, Nanotechnology, Spectroscopy, Characterization, Nanometrology, and Nanoscale Measurements