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|Author(s):||Konrad Rykaczewski; Owen J. Hildreth; Ching P. Wong; Andrei G. Fedorov; John H. Scott;|
|Title:||Directed 2D-to-3D pattern transfer method for controlled fabrication of topologically complex three- dimensional nanostructures in silicon|
|Published:||February 01, 2011|
|Abstract:||A process allowing for control over the 3D motion of catalyst nanostructures during Metal-assisted Chemical Etching by their local pinning prior to etching is developed. Topologically complex 3D structures that are partially located within the etched silicon and partially located above the silicon surface can be fabricated repeatedly with high degree of control over the rotation direction and the etch rate.|
|Pages:||pp. 659 - 663|
|Keywords:||3D fabrication, FIB, MaCE, Metal-assisted Chemical Etching|
|Research Areas:||Focused ion beam milling (FIB), Direct-write lithography, Directed self-assembly, Etch, Deposition, Nanomaterials|
|PDF version:||Click here to retrieve PDF version of paper (465KB)|