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Publication Citation: A Round Robin Experiment to Compare Methods to Measure Voids in Bonded Wafer Pairs

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Author(s): Richard A. Allen;
Title: A Round Robin Experiment to Compare Methods to Measure Voids in Bonded Wafer Pairs
Published: July 14, 2010
Abstract:
Pages: 30 pp.
Research Areas: Microelectromechanical systems (MEMS)