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|Author(s):||Lei Chen; Quandou (. Wang; Ulf Griesmann;|
|Title:||Plasma Etching Uniformity Control for Making Large and Thick Dual-Focus Zone Plates|
|Published:||January 11, 2011|
|Abstract:||In summary, an optimized plasma etching process has been developed and a Teflon ring has been made to minimize the feature size variation effect and eliminate the thick glass edge effect. Large phase type dual-focus zone plate with good etching profile and better than 2% etching depth uniformity was successfully made, which is acceptable for the error tolerance of the ROC measurement.|
|Proceedings:||36th International Conference on Micro and Nano Engineering|
|Dates:||September 19-22, 2010|
|Keywords:||reactive ion etching, uniformity, zone plate|
|PDF version:||Click here to retrieve PDF version of paper (604KB)|