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Strength distribution of single-crystal silicon theta-like specimens

Published

Author(s)

Michael S. Gaither, Frank W. DelRio, Richard S. Gates, Edwin R. Fuller, Robert F. Cook

Abstract

A new test specimen has been developed for micro-scale tensile strength measurements, allowing direct assessment of surface effects on strength. Specimens were formed by deep reactive ion etching, tested with instrumented indentation, and test results interpreted using finite element analyses. Fracture strengths reached 3 GPa; fracture initiated at processing-induced flaws.
Citation
Journal of Microelectromechanical Systems
Volume
63

Keywords

Finite element analysis (FEA), fracture strength, microelectromechanical systems (MEMS), single-crystal silicon, Weibull statistics

Citation

Gaither, M. , DelRio, F. , Gates, R. , Fuller, E. and Cook, R. (2010), Strength distribution of single-crystal silicon theta-like specimens, Journal of Microelectromechanical Systems, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=904988 (Accessed March 19, 2024)
Created May 18, 2010, Updated February 19, 2017