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|Author(s):||Kar T. Tan; Christopher C. White; Donald L. Hunston; Kristen L. Steffens; Hatlee Timothy; Kristen Hamilton; Vogt D. Bryan;|
|Title:||Roles of Adhesive and Interfacial Properties on Humidity-induced Failure|
|Published:||February 21, 2010|
|Abstract:||Adhesion loss due to moisture is a fundamental problem in a large diversity of industries ranging from microelectronics and automotive to aerospace. This study investigates the durability of model adhesive joints consisting of a homologous series of poly(n-alkyl methacrylate)s (PAMA) supported on SiOx substrates. This polymer series enables the exploration of subtle chemistry effects on moisture-induced adhesion loss. A fracture mechanics approach based on a shaft-loaded blister test was adapted to measure adhesive fracture energy of the joints exposed to extremes of humidity. Contact angle measurement, and infrared and X-ray photoelectron spectroscopic techniques were used to elucidate mechanisms of adhesion loss.|
|Proceedings:||Proceedings of the 33th Annual Meeting of the Adhesion Society, Inc.|
|Pages:||pp. 186 - 188|
|Location:||Daytona Beach, FL|
|Dates:||February 21-24, 2010|
|Keywords:||Adhesion loss, moisture effect, interface, water attack.|
|Research Areas:||Building Materials, Service Life Prediction, Building and Fire Research, Coatings/Sealants|