| Author(s): |
Michael S. Gaither; Frank W. DelRio; Richard S. Gates; Edwin R. Fuller; Robert F. Cook; |
| Title: |
Theta-like specimen to determine tensile strength at the micro-scale |
| Published: |
March 10, 2010 |
| Abstract: |
Micro- and nano-electromechanical systems are typically formed via lithographic and etching processes that leave residual surface features, stresses, and chemistry that ultimately control component strength and device reliability. Here, we describe a new test structure for micro-scale tensile strength measurements that allows for direct assessment of surface effects on strength. Specimens were formed from silicon-on-insulator wafers via deep reactive ion etching and tested with instrumented indentation. The experimental results were interpreted via finite element models to extract fracture strength. Fracture strengths as great as 3 GPa were observed, with fracture initiating at process-induced flaws and propagating along {111} and {110} planes. |
| Conference: |
The 23rd IEEE International Conference on Micro-Electro-Mechanical Systems: MEMS 2010 |
| Proceedings: |
Proceedings of the 23rd IEEE International Conference on Micro-Electro-Mechanical Systems: MEMS 2010 |
| Pages: |
pp. 540 - 543 |
| Location: |
Hong Kong SAR, -1 |
| Dates: |
January 24-28, 2010 |
| Keywords: |
Finite element analysis (FEA), fracture strength, microelectromechanical systems (MEMS), single-crystal silicon, Weibull statistics |
| Research Areas: |
Properties |
| PDF version: |
 Click here to retrieve PDF version of paper (1MB) |
