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Publication Citation: Theta-like specimen to determine tensile strength at the micro-scale

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Author(s): Michael S. Gaither; Frank W. DelRio; Richard S. Gates; Edwin R. Fuller; Robert F. Cook;
Title: Theta-like specimen to determine tensile strength at the micro-scale
Published: March 10, 2010
Abstract: Micro- and nano-electromechanical systems are typically formed via lithographic and etching processes that leave residual surface features, stresses, and chemistry that ultimately control component strength and device reliability. Here, we describe a new test structure for micro-scale tensile strength measurements that allows for direct assessment of surface effects on strength. Specimens were formed from silicon-on-insulator wafers via deep reactive ion etching and tested with instrumented indentation. The experimental results were interpreted via finite element models to extract fracture strength. Fracture strengths as great as 3 GPa were observed, with fracture initiating at process-induced flaws and propagating along {111} and {110} planes.
Conference: The 23rd IEEE International Conference on Micro-Electro-Mechanical Systems: MEMS 2010
Proceedings: Proceedings of the 23rd IEEE International Conference on Micro-Electro-Mechanical Systems: MEMS 2010
Pages: pp. 540 - 543
Location: Hong Kong SAR, -1
Dates: January 24-28, 2010
Keywords: Finite element analysis (FEA), fracture strength, microelectromechanical systems (MEMS), single-crystal silicon, Weibull statistics
Research Areas: Properties
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