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Publication Citation: A ROUND ROBIN EXPERIMENT TO PROVIDE PRECISION AND BIAS FOR SEMI MS5: TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES

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Author(s): Richard A. Allen; Winthrop A. Baylies; Paul Langer; Ralph Danzl; Frank W. DelRio; Gavin Horn; Roy Knechtel; Michael Mattes; David T. Read; Sumant Sood; Kevin T. Turner;
Title: A ROUND ROBIN EXPERIMENT TO PROVIDE PRECISION AND BIAS FOR SEMI MS5: TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES
Published: December 07, 2009
Abstract: An international round robin was organized to update SEMI Standard MS5: Test Method for Wafer Bond Strength Measurements using Micro-Chevron Test Structures. Results from the round robin allowed for inclusion of a Precision and Bias statement. The new version of MS5 shows that between-laboratory reproducibility was 152%, while the within laboratory repeatability was 111%. Since no Reference Materials exist for this method, no bias statement can be made at this time. In addition to including precision and bias, the test procedure was re-written for clarity and the analysis procedure was updated to allow for a wider range of geometry.
Conference: Procedings of the Conference on Wafer Bonding for Microsystems and Wafer Level Integration
Pages: pp. 31 - 32
Location: Grenoble, -1
Dates: December 6-8, 2009
Keywords: Microelectromechanical Systems; MEMS; Wafer Bond; Metrology
Research Areas: Microelectromechanical systems (MEMS)
PDF version: PDF Document Click here to retrieve PDF version of paper (969KB)