| Author(s): |
Richard A. Allen; Winthrop A. Baylies; Paul Langer; Ralph Danzl; Frank W. DelRio; Gavin Horn; Roy Knechtel; Michael Mattes; David T. Read; Sumant Sood; Kevin T. Turner; |
| Title: |
A ROUND ROBIN EXPERIMENT TO PROVIDE PRECISION AND BIAS FOR SEMI MS5: TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES |
| Published: |
December 07, 2009 |
| Abstract: |
An international round robin was organized to update SEMI Standard MS5: Test Method for Wafer Bond Strength Measurements using Micro-Chevron Test Structures. Results from the round robin allowed for inclusion of a Precision and Bias statement. The new version of MS5 shows that between-laboratory reproducibility was 152%, while the within laboratory repeatability was 111%. Since no Reference Materials exist for this method, no bias statement can be made at this time. In addition to including precision and bias, the test procedure was re-written for clarity and the analysis procedure was updated to allow for a wider range of geometry. |
| Conference: |
Procedings of the Conference on Wafer Bonding for Microsystems and Wafer Level Integration |
| Pages: |
pp. 31 - 32 |
| Location: |
Grenoble, -1 |
| Dates: |
December 6-8, 2009 |
| Keywords: |
Microelectromechanical Systems; MEMS; Wafer Bond; Metrology |
| Research Areas: |
Microelectromechanical systems (MEMS) |
| PDF version: |
 Click here to retrieve PDF version of paper (946KB) |
