| Author(s): |
Robert F. Cook; Yvonne B. Gerbig; Mark D. Vaudin; Jeroen Schoenmaker; Stephan J. Stranick; |
| Title: |
Stress-Intensity Factor and Toughness Measurement at the Nanoscale using Confocal Raman Microscopy |
| Published: |
July 12, 2009 |
| Abstract: |
A confocal Raman microscopy technique is presented that allows stress measurement at the nanoscale, which in turn enables measurement of stress-intensity factors (SIF) at crack tips and thus toughness to be estimated. Peak-fitting and super-resolution techniques enable stress resolution of approximately 20 MPa at spatial resolution of approximately 100 nm. Micro- and nano-indentation and crack field stress distributions are measured and compared with analytical expressions. The SIF for indentation cracks in Si is shown to be in the range 0.2 MPa m1/2 to 0.4 MPa m1/2, consistent with chipping-induced indentation stress relief and the toughness of Si. |
| Proceedings: |
12th International Conference on Fracture |
| Pages: |
10 pp. |
| Location: |
Ottawa, CA |
| Dates: |
July 12-17, 2009 |
| Research Areas: |
Properties |
| PDF version: |
 Click here to retrieve PDF version of paper (164KB) |
