Josell, D.
, Wallace, W.
and Wheeler, D.
(2001),
Wafer Level Underfill: Experiments and Modeling., NIST Interagency/Internal Report (NISTIR), National Institute of Standards and Technology, Gaithersburg, MD, [online], https://doi.org/10.6028/NIST.IR.6731, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853766
(Accessed May 5, 2024)
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Wafer Level Underfill: Experiments and Modeling.
Published
Author(s)
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Citation
NIST Interagency/Internal Report (NISTIR) - 6731
Report Number
6731
NIST Pub Series
Pub Type
NIST Pubs
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Keywords
Electronic Materials, Flipchip, Microscopy, Simulations & Modeling, Solder, Surface Evolver, Underfill
Citation
Created December 31, 2000, Updated October 12, 2021