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Publication Citation: Thermal Cycling of Buried Damascene Copper Interconnect Lines by Joule Heating

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Author(s): David T. Read; Roy H. Geiss;
Title: Thermal Cycling of Buried Damascene Copper Interconnect Lines by Joule Heating
Published: January 01, 2008
Abstract: We report tests to failure of 300 nm wide damascene copper interconnect lines in silicon oxide dielectric, under high amplitude, low frequency alternating current. The cyclic minimum and maximum resistances were obtained from the measured voltage and current waveforms, and remained essentially constant over the lifetime tests. In the lines tested to failure under voltage control at the highest current levels, observed features of the remaining copper deposits seemed to indicate repeated melting over multiple cycles of current. The lifetimes, plotted against temperature, formed a nearly straight line on a semi-log plot, even though the failures, particularly those run under voltage control, became considerably less catastrophic for the longer lifetimes. Understanding the individual and combined effects of the temperature, current, and thermomechanical stresses will open up the possibilities for utilizing these electrical tests in systematic assessments of interconnect reliability and quality control.
Conference: NSTI Nanotech 2008
Proceedings: NSTI Nanotech 2008 Proceedings
Pages: pp. 218 - 221
Location: Boston, MA
Dates: June 1-5, 2008
Keywords: alternating current, fatigue, stress, temperature, voids
Research Areas: Nanomaterials
PDF version: PDF Document Click here to retrieve PDF version of paper (1MB)