NIST logo

Publication Citation: Thermally Induced Stress Relaxation and Densification of Spin-on-Glass Thin Films

NIST Authors in Bold

Author(s): C. K. Chiang; William E. Wallace III; G W. Lynn; D Feiler; W. Xia;
Title: Thermally Induced Stress Relaxation and Densification of Spin-on-Glass Thin Films
Published: January 01, 2000
Abstract: The stress-temperature relationship of silica spin-on-glass thin films on silicon wafers was studied. Upon heating the stress-temperature curves showed a dramatically increasing slope when the temperature of the film was greater than 340 C. At 450 C, a significant, irreversible change in the stress of the film was observed. This change in stress was correlated with an increase in film electron density and a decrease in film thickness. This observed thermally activated stress-relaxation behavior was interpreted in terms of reflow of the glassy hydrogen-silsequioxane-based material.
Citation: Applied Physics Letters
Volume: 76
Issue: No. 4
Keywords: hydrogen-silsesquioxane;low-K dielectric;spin-on-glass;stress;thin-film
Research Areas: Polymers, Thin-Films
PDF version: PDF Document Click here to retrieve PDF version of paper (51KB)