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|Author(s):||C. K. Chiang; William E. Wallace; G W. Lynn; D Feiler; W. Xia;|
|Title:||Thermally Induced Stress Relaxation and Densification of Spin-on-Glass Thin Films|
|Published:||January 01, 2000|
|Abstract:||The stress-temperature relationship of silica spin-on-glass thin films on silicon wafers was studied. Upon heating the stress-temperature curves showed a dramatically increasing slope when the temperature of the film was greater than 340 C. At 450 C, a significant, irreversible change in the stress of the film was observed. This change in stress was correlated with an increase in film electron density and a decrease in film thickness. This observed thermally activated stress-relaxation behavior was interpreted in terms of reflow of the glassy hydrogen-silsequioxane-based material.|
|Citation:||Applied Physics Letters|
|Research Areas:||Polymers, Thin-Films|
|PDF version:||Click here to retrieve PDF version of paper (51KB)|